METHODS AND DEVICES FOR TESTING MULTIPLE MEMORY CONFIGURATIONS

    公开(公告)号:US20220148669A1

    公开(公告)日:2022-05-12

    申请号:US17582114

    申请日:2022-01-24

    Abstract: Methods, devices, and systems for testing a number of combinations of memory in a computer system. A modular memory device is installed in a memory channel in communication with a processor. The modular memory device includes a number of memory storage devices. The number of memory storage devices include a number of pins. For each of a number of subsets of the number of memory storage devices, a subset of the number of memory storage devices is selected, each pin of a subset of the number of pins which do not correspond to the subset of the number of memory storage devices is configured with a termination impedance, and the subset of the number of memory storage devices is tested.

    Methods and devices for testing multiple memory configurations

    公开(公告)号:US11232847B2

    公开(公告)日:2022-01-25

    申请号:US16578209

    申请日:2019-09-20

    Abstract: Methods, devices, and systems for testing a number of combinations of memory in a computer system. A modular memory device is installed in a memory channel in communication with a processor. The modular memory device includes a number of memory storage devices. The number of memory storage devices include a number of pins. A subset of the number of memory storage devices is selected. A subset of the plurality of pins which do not correspond to the subset of the number of memory storage devices and are not part of a memory map of the computer system is selected. Each pin of the subset of the plurality of pins configured with a termination impedance. The subset of the number of memory storage devices is tested.

    METHODS AND DEVICES FOR TESTING MULTIPLE MEMORY CONFIGURATIONS

    公开(公告)号:US20210090676A1

    公开(公告)日:2021-03-25

    申请号:US16578209

    申请日:2019-09-20

    Abstract: Methods, devices, and systems for testing a number of combinations of memory in a computer system. A modular memory device is installed in a memory channel in communication with a processor. The modular memory device includes a number of memory storage devices. The number of memory storage devices include a number of pins. For each of a number of subsets of the number of memory storage devices, a subset of the number of memory storage devices is selected, each pin of a subset of the number of pins which do not correspond to the subset of the number of memory storage devices is configured with a termination impedance, and the subset of the number of memory storage devices is tested.

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