公开(公告)号：US20190122704A1

公开(公告)日：2019-04-25

申请号：US16229406

申请日：2018-12-21

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： Wei HUANG

IPC: G11C7/04 ,  H01L23/38 ,  H01L35/32 ,  H01L27/16 ,  H01L27/108

CPC classification number: G11C7/04 ,  H01L23/38 ,  H01L27/0688 ,  H01L27/10897 ,  H01L27/16 ,  H01L35/32

Abstract: Managing temperature of a semiconductor device having a temperature inverted processor core and stacked memory by operation of an integrated thermoelectric cooler. The thermoelectric cooler is operated to pump heat from a stacked memory device that requires a cool operating temperature to a temperature inverted processor core that maintains a higher operating temperature until threshold operating temperatures are achieved.

公开(公告)号：US20180358080A1

公开(公告)日：2018-12-13

申请号：US15618349

申请日：2017-06-09

Applicant: Advanced Micro Devices, Inc.

Inventor： Wei HUANG

IPC: G11C11/4078 ,  H01L27/108 ,  H01L23/38 ,  H01L35/32 ,  H01L27/16

CPC classification number: G11C7/04 ,  H01L23/38 ,  H01L27/10897 ,  H01L27/16 ,  H01L35/32

Abstract: Managing temperature of a semiconductor device having a temperature inverted processor core and stacked memory by operation of an integrated thermoelectric cooler. The thermoelectric cooler is operated to pump heat from a stacked memory device that requires a cool operating temperature to a temperature inverted processor core that maintains a higher operating temperature until threshold operating temperatures are achieved.