公开(公告)号：US20240234304A1

公开(公告)日：2024-07-11

申请号：US18402688

申请日：2024-01-02

申请人： Advanced Micro Devices, Inc. ,  ATI Technologies ULC

发明人： Deepak Vasant KULKARNI ,  Samuel NAFFZIGER ,  Raja SWAMINATHAN ,  Matthew STRAAYER ,  Justin Michael BURKHART ,  Sri Ranga Sai BOYAPATI ,  Hemanth Kumar DHAVALESWARAPU ,  Alexander Helmut PFEIFFENBERGER ,  Manjunath D. HARITSA

IPC分类号： H01L23/522 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L23/5227 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/29 ,  H01L25/0652 ,  H01L2224/13025 ,  H01L2224/13147 ,  H01L2224/29009 ,  H01L2224/29025 ,  H01L2924/1206 ,  H01L2924/1427 ,  H01L2924/1431 ,  H01L2924/15311

摘要： Chip packages are described herein that includes chiplets embedded in a core of a substrate of the chip package, such as a package substrate or an interposer. In one example, the chiplet includes voltage regulation circuitry that is coupled through a substrate core embedded inductor to an integrated circuit (IC) die mounted to the substrate.