公开(公告)号：US11888081B2

公开(公告)日：2024-01-30

申请号：US17227152

申请日：2021-04-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Chang Chin Tsai ,  Bo-Yu Huang ,  Ying-Chung Chen

IPC: H01L31/16 ,  H04B10/40 ,  H01L33/64 ,  H01L33/62 ,  H01L31/024

CPC classification number: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/644 ,  H04B10/40

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.