公开(公告)号：US20230045587A1

公开(公告)日：2023-02-09

申请号：US17396596

申请日：2021-08-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jenchun CHEN ,  Chang-Fu LU

IPC: H01Q21/08 ,  H01Q9/04

Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier and an antenna element. The carrier includes a plurality of pads and has a surface exposing the pads. The antenna element is disposed above the pads. A lateral surface of one of the pads is farther from a central axis of the antenna element substantially perpendicular to the surface than from a lateral surface of the antenna element.

公开(公告)号：US20250048541A1

公开(公告)日：2025-02-06

申请号：US18923638

申请日：2024-10-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jhen CIOU ,  Jenchun CHEN ,  Chang-Fu LU ,  Pai-Sheng SHIH

IPC: H05K1/02 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

公开(公告)号：US20230269866A1

公开(公告)日：2023-08-24

申请号：US17680069

申请日：2022-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jhen CIOU ,  Jenchun CHEN ,  Chang-Fu LU ,  Pai-Sheng SHIH

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K2201/10098

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.