公开(公告)号：US20250048541A1

公开(公告)日：2025-02-06

申请号：US18923638

申请日：2024-10-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jhen CIOU ,  Jenchun CHEN ,  Chang-Fu LU ,  Pai-Sheng SHIH

IPC: H05K1/02 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

公开(公告)号：US20230269866A1

公开(公告)日：2023-08-24

申请号：US17680069

申请日：2022-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Jhen CIOU ,  Jenchun CHEN ,  Chang-Fu LU ,  Pai-Sheng SHIH

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0271 ,  H05K1/181 ,  H05K2201/10098

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.