公开(公告)号：US20160218019A1

公开(公告)日：2016-07-28

申请号：US15088683

申请日：2016-04-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuan-Chang SU ,  Shih-Fu HUANG ,  Chia-Cheng CHEN

IPC: H01L21/48 ,  H01L23/00 ,  H01L21/683

CPC classification number: H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2221/68345 ,  H01L2224/27013 ,  H01L2224/32188 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/484 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A package carrier includes: (1) a dielectric layer; (2) a first electrically conductive pattern, embedded in the dielectric layer and disposed adjacent to a first surface of the dielectric layer, and including a plurality of first pads; (3) a plurality of first electrically conductive posts, extending through the dielectric layer, wherein each of the first electrically conductive posts includes a first electrically conductive post segment connected to at least one of the first pads and a second electrically conductive post segment connected to the first electrically conductive post segment, and a lateral extent of the first electrically conductive post segment is different from a lateral extent of the second electrically conductive post segment; and (4) a second electrically conductive pattern, disposed adjacent to a second surface of the dielectric layer, and including a plurality of second pads connected to respective ones of the second electrically conductive post segments.

Abstract translation: 包装载体包括：（1）电介质层; （2）第一导电图案，其嵌入在所述电介质层中并且邻近所述电介质层的第一表面设置，并且包括多个第一焊盘; （3）延伸穿过介电层的多个第一导电柱，其中每个第一导电柱包括连接到至少一个第一焊盘的第一导电柱段和连接到第一导电柱段的第二导电柱段 第一导电柱段和第一导电柱段的横向范围不同于第二导电柱段的横向范围; 以及（4）第二导电图案，其邻近所述电介质层的第二表面设置，并且包括连接到所述第二导电柱段中的相应一个的多个第二焊盘。