公开(公告)号：US11973039B2

公开(公告)日：2024-04-30

申请号：US17336078

申请日：2021-06-01

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Chia-Hao Sung ,  Hsuan-Yu Chen ,  Yu-Kai Lin

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L2224/214 ,  H01L2924/3511

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.

公开(公告)号：US11101189B2

公开(公告)日：2021-08-24

申请号：US16885150

申请日：2020-05-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming Yen Lee ,  Chia-Hao Sung ,  Ching-Han Huang ,  Yu-Hsuan Tsai

IPC: H01L21/31 ,  H01L23/31 ,  B81B3/00 ,  B81C1/00 ,  H01L23/538 ,  H01L23/48 ,  H01L23/522 ,  H01L23/52 ,  H01L23/525 ,  H01L21/66 ,  B81C3/00 ,  H01L23/13 ,  H01L23/12 ,  H01L23/28 ,  B81B7/00

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

公开(公告)号：US11024586B2

公开(公告)日：2021-06-01

申请号：US16254382

申请日：2019-01-22

Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.

Inventor： Chia-Hao Sung ,  Hsuan-Yu Chen ,  Yu-Kai Lin

IPC: H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56

Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.