公开(公告)号：US20210391278A1

公开(公告)日：2021-12-16

申请号：US17461880

申请日：2021-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hua TAI ,  Pai-Chou LIU ,  Yun-Chih FEI ,  Wen-Pin HUANG ,  Sheng-Hong ZHENG

IPC: H01L23/552 ,  H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

公开(公告)号：US20210130163A1

公开(公告)日：2021-05-06

申请号：US16670790

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yueh-Ju LIN ,  Chih-Cheng HUNG ,  Chin-Song LEE ,  Yun-Chih FEI

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device package includes a redistribution layer structure, a semiconductor component, an encapsulant and a sensing component. The semiconductor component is disposed on a top surface of the RDL structure. The encapsulant covers the semiconductor component, the RDL structure, and an electrical connection member. The sensing component is disposed on a top surface of the encapsulant. The electrical connection member is in contact with a pad of the semiconductor component and has a first surface exposed from the top surface of the encapsulant, and the semiconductor component package includes a wire connecting the sensing component and the first surface of the electrical connection member.

公开(公告)号：US20200335452A1

公开(公告)日：2020-10-22

申请号：US16388834

申请日：2019-04-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hua TAI ,  Pai-Chou LIU ,  Yun-Chih FEI ,  Wen-Pin HUANG ,  Sheng-Hong ZHENG

IPC: H01L23/552 ,  H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.