公开(公告)号：US20210130163A1

公开(公告)日：2021-05-06

申请号：US16670790

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yueh-Ju LIN ,  Chih-Cheng HUNG ,  Chin-Song LEE ,  Yun-Chih FEI

IPC: B81B7/00 ,  B81C1/00 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor device package includes a redistribution layer structure, a semiconductor component, an encapsulant and a sensing component. The semiconductor component is disposed on a top surface of the RDL structure. The encapsulant covers the semiconductor component, the RDL structure, and an electrical connection member. The sensing component is disposed on a top surface of the encapsulant. The electrical connection member is in contact with a pad of the semiconductor component and has a first surface exposed from the top surface of the encapsulant, and the semiconductor component package includes a wire connecting the sensing component and the first surface of the electrical connection member.

公开(公告)号：US20210118806A1

公开(公告)日：2021-04-22

申请号：US16657882

申请日：2019-10-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hua TAI ,  Yueh-Ju LIN ,  Wen Shang CHANG ,  Wen-Pin HUANG

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package includes a first carrier, a first electronic component, a second electronic component, a second carrier and an electrical connection structure. The first carrier has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the first carrier. The second electronic component is disposed on the second surface of the first carrier. The second carrier has a first surface facing the second surface of the first carrier and a second surface opposite to the first surface. The electrical connection structure is electrically connecting the first carrier with the second carrier

公开(公告)号：US20210130165A1

公开(公告)日：2021-05-06

申请号：US16670683

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yung-Hsing CHANG ,  Yueh-Ju LIN

IPC: B81B7/00 ,  B81C1/00

Abstract: A semiconductor device package includes a redistribution layer structure, a lid, a sensing component and an encapsulant. The lid is disposed on the redistribution layer structure and defines a cavity together with the redistribution layer structure. The sensing component is disposed in the cavity. The encapsulant surrounds the lid.