公开(公告)号：US12027469B2

公开(公告)日：2024-07-02

申请号：US17500920

申请日：2021-10-13

申请人： Advanced Semiconductor Engineering, Inc.

发明人： En Hao Hsu ,  Kuo Hwa Tzeng ,  Chia-Pin Chen ,  Chi Long Tsai

IPC分类号： H01L23/31 ,  H01L23/00 ,  H01L23/16

CPC分类号： H01L23/562 ,  H01L23/16 ,  H01L23/3107 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/022 ,  H01L2224/02377 ,  H01L2224/13018

摘要： An electronic device package and manufacturing method thereof are provided. The electronic device package includes an electronic component including an active surface, a patterned conductive layer disposed on the active surface, an encapsulation layer disposed over the patterned conductive layer, and a buffer layer disposed between the patterned conductive layer and the encapsulation layer. The buffer layer is shaped and sized to alleviate a stress generated due to an interaction between the patterned conductive layer and the encapsulation layer.