公开(公告)号：US20240290515A1

公开(公告)日：2024-08-29

申请号：US18114181

申请日：2023-02-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wu Chou HSU ,  Hung Yi CHUANG ,  Shin-Luh TARNG

IPC: H01B1/20 ,  H05K1/02 ,  H05K1/11 ,  H05K5/00

CPC classification number: H01B1/20 ,  H05K1/0233 ,  H05K1/115 ,  H05K5/0026

Abstract: A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the conductive wire. The first connection element is disposed outside the magnetic layer.

公开(公告)号：US20240112848A1

公开(公告)日：2024-04-04

申请号：US17956681

申请日：2022-09-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wu Chou HSU ,  Hung Yi CHUANG

IPC: H01F27/28 ,  H01F27/24

CPC classification number: H01F27/2823 ,  H01F27/24

Abstract: A package structure is provided. The package structure includes an electronic component and a connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The connection element penetrates and contacts the magnetic layer and the conductive wire.