公开(公告)号：US20230039552A1

公开(公告)日：2023-02-09

申请号：US17968725

申请日：2022-10-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Tau HUANG ,  Kuei-Hao TSENG ,  Hung-I LIN

IPC: H04R1/10 ,  B81B7/00

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

公开(公告)号：US20220346715A1

公开(公告)日：2022-11-03

申请号：US17244876

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Te Kao TSUI ,  Kai Hung WANG ,  Hung-I LIN

IPC: A61B5/00 ,  H05K1/02

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.

公开(公告)号：US20210037304A1

公开(公告)日：2021-02-04

申请号：US16528338

申请日：2019-07-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Tau HUANG ,  Kuei-Hao TSENG ,  Hung-I LIN

IPC: H04R1/10 ,  B81B7/00

Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.