公开(公告)号：US20230017424A1

公开(公告)日：2023-01-19

申请号：US17374748

申请日：2021-07-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Pang Yuan LEE ,  Kuei-Hao TSENG ,  Chih Lung LIN

IPC: H01L23/31 ,  H01L23/528

Abstract: The present disclosure provides an electronic apparatus including a first surface, a second surface, a third surface, a plurality of conductive elements, and an encapsulant. The second surface is nonparallel to the first surface. The third surface is distinct from the first surface and the second surface. The plurality of conductive elements are exposed from the second surface. The encapsulant covers the third surface and exposes the first surface and the second surface.

公开(公告)号：US20250080895A1

公开(公告)日：2025-03-06

申请号：US18241206

申请日：2023-08-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kai Hung WANG ,  Kuei-Hao TSENG ,  Chih Lung LIN

IPC: H04R1/10

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element and a deformable element configured to convert energy from one form to make the flexible element compliant with a user's skin.

公开(公告)号：US20240395784A1

公开(公告)日：2024-11-28

申请号：US18202243

申请日：2023-05-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Chih Lung LIN

IPC: H01L25/16 ,  A61B5/256 ,  H01L23/00 ,  H01L23/31

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible carrier, an electronic component disposed over the flexible carrier, and a first flexible connection element configured to connect the flexible carrier and the electronic component. The first flexible connection element is configured to extend along a deformation direction of the electronic device. An interconnection structure is also provided.

公开(公告)号：US20230019715A1

公开(公告)日：2023-01-19

申请号：US17377168

申请日：2021-07-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Chih LEE ,  Chih Lung LIN

IPC: A61B5/00 ,  A61B5/318 ,  A61B5/389 ,  A61B5/398

Abstract: The present disclosure provides a detection module including a carrier configured to be adjustable to at least partially conform to a shape of a wearable object. The detection module further includes a sensing element in contact with the carrier and at least partially exposed from the carrier.

公开(公告)号：US20220345812A1

公开(公告)日：2022-10-27

申请号：US17242093

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/24 ,  H04R1/26 ,  G02C11/00

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US20220345811A1

公开(公告)日：2022-10-27

申请号：US17242060

申请日：2021-04-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/26 ,  H04R1/24

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. A location of the first transducer is configured to be adjustable with respect to the second transducer.

公开(公告)号：US20250080894A1

公开(公告)日：2025-03-06

申请号：US18240324

申请日：2023-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuei-Hao TSENG ,  Kai Hung WANG ,  Chih Lung LIN

IPC: H04R1/10 ,  H04R1/02

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element having a channel, a first cover at least covering the channel, and a transducing element connected with the flexible element. The transducing element is configured to convert energy from one form to another to deform and affect the flexible element to adjust a dimension of the first cover.

公开(公告)号：US20230199378A1

公开(公告)日：2023-06-22

申请号：US18109792

申请日：2023-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Kai Hung WANG

IPC: H04R1/40 ,  H04R3/12 ,  H04R1/26 ,  G02C11/00 ,  H04R1/24

CPC classification number: H04R1/403 ,  G02C11/10 ,  H04R1/24 ,  H04R1/26 ,  H04R3/12 ,  H04R2201/401

Abstract: An electronic module is provided. The electronic module includes a first transducer and a second transducer. The first transducer is configured to radiate a first ultrasonic wave. The second transducer is configured to radiate a second ultrasonic wave. The first transducer and the second transducer are disposed on noncoplanar surfaces.

公开(公告)号：US20220346715A1

公开(公告)日：2022-11-03

申请号：US17244876

申请日：2021-04-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chih Lung LIN ,  Kuei-Hao TSENG ,  Te Kao TSUI ,  Kai Hung WANG ,  Hung-I LIN

IPC: A61B5/00 ,  H05K1/02

Abstract: The present disclosure provides an electronic device. The electronic device includes a flexible element, and a sensing element adjacent to the flexible element and configured to detect a biosignal. The electronic device also includes an active component in the flexible element and electrically connected with the sensing element. A method of manufacturing an electronic device is also disclosed.