公开(公告)号：US20210225741A1

公开(公告)日：2021-07-22

申请号：US16749793

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Jen CHEN ,  Guo-Cheng LIAO ,  Jyun-Chi JHAN ,  Hui-Chen HSU

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.

公开(公告)号：US20240250006A1

公开(公告)日：2024-07-25

申请号：US18098827

申请日：2023-01-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Jen CHEN

IPC: H01L23/495

CPC classification number: H01L23/49541 ,  H01L23/49503

Abstract: The present disclosure provides a package structure. The package structure includes a die bonding region and a first lead region. The first lead region extends along a first direction. The first direction is along a first edge of the die bonding region. The first lead region includes a first high density lead region and a first low density lead region. The first high density lead region overlaps the first low density lead region in the first direction.