公开(公告)号：US20190164859A1

公开(公告)日：2019-05-30

申请号：US15823467

申请日：2017-11-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsan-Hsien CHEN ,  Ian HU ,  Jin-Feng YANG ,  Shih-Wei CHEN ,  Hui-Chen HSU

IPC: H01L23/31 ,  H01L23/433 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/373

CPC classification number: H01L23/3128 ,  H01L21/4814 ,  H01L21/565 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/1134 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.

公开(公告)号：US20230268254A1

公开(公告)日：2023-08-24

申请号：US17676092

申请日：2022-02-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui-Chen HSU

IPC: H01L23/495

CPC classification number: H01L23/49548 ,  H01L23/49503

Abstract: An electronic device is provided. The electronic device includes a circuit pattern layer. The circuit pattern layer includes a first surface, a second surface recessed with respect to the first surface; and a third surface recessed with respect to the first surface and adjacent to and spaced apart from the second surface. The second surface and the third surface are mis-aligned with each other.

公开(公告)号：US20210225741A1

公开(公告)日：2021-07-22

申请号：US16749793

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Jen CHEN ,  Guo-Cheng LIAO ,  Jyun-Chi JHAN ,  Hui-Chen HSU

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.

公开(公告)号：US20220165682A1

公开(公告)日：2022-05-26

申请号：US17100553

申请日：2020-11-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hui-Yu LEE ,  Hui-Chen HSU

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package structure includes a semiconductor package structure includes a first supporting bar, a second supporting bar and an encapsulant. The second supporting bar is adjacent to the first supporting bar. The first supporting bar and the second supporting bar extend substantially along a first direction. The encapsulant covers the first supporting bar and the second supporting bar. The encapsulant defines a first recess and a second recess recessed from a lower surface of the encapsulant. The first recess extends substantially along a second direction different from the first direction. The second recess is located between the first recess and the second supporting bar.