公开(公告)号：US20210225741A1

公开(公告)日：2021-07-22

申请号：US16749793

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： I-Jen CHEN ,  Guo-Cheng LIAO ,  Jyun-Chi JHAN ,  Hui-Chen HSU

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: A lead frame includes a die paddle, a first lead, a second lead, an extending portion and at least one supporting portion. The first lead includes a first main portion and a first I/O portion opposite to the first main portion. The second lead includes a second main portion and a second I/O portion opposite to the second main portion. The first lead and the second lead surround the die paddle. The extending portion extends from the first main portion of the first lead. The supporting portion is connected to the extending portion.

公开(公告)号：US20210225742A1

公开(公告)日：2021-07-22

申请号：US16749586

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jyun-Chi JHAN ,  Guo-Cheng LIAO

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/00

Abstract: Present disclosure provides a lead frame, including a die paddle and a plurality of leads surrounding the die paddle. Each of the leads including a finger portion proximal to the die paddle and a lead portion distal from the die paddle. The finger portion includes a main body and at least one support structure. The respective support structures on adjacent leads are mutually isolated, and a distance between the support structure and the die paddle is smaller than a distance between the lead portion and the die paddle. A semiconductor package structure including the lead frame described herein and a semiconductor package assembly including the semiconductor package structure described herein are also provided.