公开(公告)号：US20230027674A1

公开(公告)日：2023-01-26

申请号：US17958237

申请日：2022-09-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jhao-Cheng CHEN ,  Huang-Hsien CHANG ,  Wen-Long LU ,  Shao Hsuan CHUANG ,  Ching-Ju CHEN ,  Tse-Chuan CHOU

IPC: H01L23/00

Abstract: A semiconductor device and method for manufacturing the same are provided. The method includes providing a first substrate. The method also includes forming a first metal layer on the first substrate. The first metal layer includes a first metal material. The method further includes treating a first surface of the first metal layer with a solution including an ion of a second metal material. In addition, the method includes forming a plurality of metal particles including the second metal material on a portion of the first surface of the first metal layer.

公开(公告)号：US20210296267A1

公开(公告)日：2021-09-23

申请号：US16825713

申请日：2020-03-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jhao-Cheng CHEN ,  Huang-Hsien CHANG ,  Wen-Long LU ,  Shao Hsuan CHUANG ,  Ching-Ju CHEN ,  Tse-Chuan CHOU

IPC: H01L23/00

Abstract: A semiconductor device and method for manufacturing the same are provided. The method includes providing a first substrate. The method also includes forming a first metal layer on the first substrate. The first metal layer includes a first metal material. The method further includes treating a first surface of the first metal layer with a solution including an ion of a second metal material. In addition, the method includes forming a plurality of metal particles including the second metal material on a portion of the first surface of the first metal layer.