公开(公告)号：US11844199B2

公开(公告)日：2023-12-12

申请号：US17585416

申请日：2022-01-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Chieh Hung ,  Chen-Chao Wang

IPC: H05K1/18 ,  H05K7/20 ,  H05K1/02

CPC classification number: H05K7/209 ,  H05K1/0216 ,  H05K1/181

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component, a first power regulator disposed above the first electronic component. The first power regulator is configured to receive a first power along a lateral surface of the first electronic component without passing the first electronic component and to provide a second power to the first electronic component. The electronic device also includes a passive component disposed in an electrical path between the first electronic component and the first power regulator.

公开(公告)号：US11990385B2

公开(公告)日：2024-05-21

申请号：US17681694

申请日：2022-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Chieh Hung ,  Hung-Chun Kuo

IPC: H01L23/367 ,  H01L23/48 ,  H01L23/50 ,  H01L23/538 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/3677 ,  H01L23/481 ,  H01L23/50 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/18 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/17181

Abstract: An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.