公开(公告)号：US11302682B2

公开(公告)日：2022-04-12

申请号：US16664652

申请日：2019-10-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yueh Tsai ,  Meng-Jen Wang ,  Yu-Fang Tsai ,  Meng-Jung Chuang

IPC: H01L25/16 ,  H01L23/31 ,  H01L21/52 ,  H01L23/538 ,  H01L21/48

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.

公开(公告)号：US12009353B2

公开(公告)日：2024-06-11

申请号：US17719280

申请日：2022-04-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsung-Yueh Tsai ,  Meng-Jen Wang ,  Yu-Fang Tsai ,  Meng-Jung Chuang

IPC: H01L25/16 ,  H01L21/48 ,  H01L21/52 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L25/167 ,  H01L21/4817 ,  H01L21/52 ,  H01L23/3128 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/165

Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.