公开(公告)号：US20180047651A1

公开(公告)日：2018-02-15

申请号：US15675610

申请日：2017-08-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Shao-An CHEN ,  Po-Wei LU ,  Ming Tsung SHEN ,  Yu-Tzu PENG

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/538 ,  H01L21/56

Abstract: The present disclosure relates to wafer level packages including one or more semiconductor dies and a method of manufacturing the same. A method comprises: providing a carrier having a predetermined area, disposing a semiconductor device on the predetermined area, and forming a sacrificial wall on a periphery of the predetermined area.