公开(公告)号：US11874515B2

公开(公告)日：2024-01-16

申请号：US17588105

申请日：2022-01-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Po-I Wu ,  Ming-Fong Jhong

IPC: G02B6/43 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/4277 ,  G02B6/4284

Abstract: The present disclosure relates to an electronic device that includes a waveguide, a plurality of transceiving portions over the waveguide, and a cavity between the waveguide and the transceiving portions and connecting the waveguide with the transceiving portions. The cavity is configured for resonating of an electromagnetic wave from the waveguide or the transceiving portions.

公开(公告)号：US11232998B2

公开(公告)日：2022-01-25

申请号：US16732054

申请日：2019-12-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Fong Jhong ,  Chen-Chao Wang ,  Hung-Chun Kuo

IPC: H01L23/48 ,  H01L21/768 ,  H01L23/522 ,  H01L21/48 ,  H01L23/528 ,  H01L23/498

Abstract: A semiconductor device package includes a substrate, a first circuit layer and a second circuit layer. The first circuit layer is disposed on the substrate. The first circuit layer has a plurality of dielectric layers and a first through via penetrating the dielectric layers and electrically connected to the substrate. The second circuit layer is disposed on the first circuit layer. The second circuit layer has a plurality of dielectric layers and a second through via penetrating the dielectric layers and electrically connected to the first circuit layer.

公开(公告)号：US10186779B2

公开(公告)日：2019-01-22

申请号：US15348854

申请日：2016-11-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Yu Ho ,  Chen-Chao Wang ,  Chun-Yen Ting ,  Ming-Fong Jhong ,  Po-Chih Pan

IPC: H01L23/34 ,  H01Q9/04 ,  H01L23/538 ,  H01L23/552 ,  H01L23/66 ,  H01L25/065 ,  H01Q13/10 ,  H01Q19/30 ,  H01Q21/28 ,  H01L23/00

Abstract: Various embodiments of the present disclosure relate to a semiconductor device package including a carrier, an electrical component, an antenna, a conductive pad and a conductive line. The carrier includes a top surface. The electrical component is disposed over the top surface of the carrier. The antenna is disposed over the top surface of the carrier and spaced away from the electrical component. The conductive pad is disposed over the top surface of the carrier and beneath the antenna, wherein the conductive pad includes a resonant structure. The conductive line is electrically connected to the electrical component and extends within the carrier. A part of the conductive line is beneath the antenna and the resonant structure of the conductive pad.