公开(公告)号：US20180213312A1

公开(公告)日：2018-07-26

申请号：US15879335

申请日：2018-01-24

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsu-Liang Hsiao ,  Yu-Hsuan Tsai ,  Pu Shan Huang ,  Ching-Han Huang ,  Lu-Ming Lai

IPC: H04R1/04 ,  B81B7/00 ,  B81C1/00 ,  H04R1/02

CPC classification number: H04R1/04 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/096 ,  B81C1/00309 ,  H04R1/021 ,  H04R1/2807 ,  H04R31/00 ,  H04R2201/003 ,  H04R2410/03

Abstract: A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.