OPTOELECTRONIC PACKAGE STRUCTURE
    1.
    发明申请

    公开(公告)号:US20240411096A1

    公开(公告)日:2024-12-12

    申请号:US18208226

    申请日:2023-06-09

    Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component and an optical interposer. The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.

    OPTICAL DEVICE
    2.
    发明公开
    OPTICAL DEVICE 审中-公开

    公开(公告)号:US20240219628A1

    公开(公告)日:2024-07-04

    申请号:US18092145

    申请日:2022-12-30

    CPC classification number: G02B6/12004

    Abstract: An optical device is provided. The optical device includes a first photonic component; a first electronic component at least partially over the first photonic component; and an optical connection element at least partially over the first photonic component, the optical connection element being separated from the first electronic component.

    DEVICE FOR COMMUNICATION
    5.
    发明申请

    公开(公告)号:US20220196934A1

    公开(公告)日:2022-06-23

    申请号:US17127666

    申请日:2020-12-18

    Abstract: A device is provided. The device may be an optical device, a light coupling device, or a device containing an optical structure. The device includes a waveguide, a cladding, and a light coupling material. The light coupling material is disposed adjacent to the waveguide and has a first surface and a second surface, where the second surface is disposed further away from the waveguide than the first surface and a thickness of the second surface is greater than that of the first surface.

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