公开(公告)号：US20240329387A1

公开(公告)日：2024-10-03

申请号：US18127622

申请日：2023-03-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Jr-Wei LIN ,  Pei-Jung YANG

IPC: G02B26/08

CPC classification number: G02B26/0816

Abstract: An optical package is provided. The optical package includes a first optical device and an optical guiding structure. The first optical device is disposed over a carrier. The optical guiding structure is disposed over the carrier and configured to adjust a first optical transmission path of the first optical device.

公开(公告)号：US20240113061A1

公开(公告)日：2024-04-04

申请号：US18530123

申请日：2023-12-05

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Chi-Han CHEN ,  Chang-Yu LIN ,  Jr-Wei LIN ,  Chih-Pin HUNG

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17177 ,  H01L2224/73204 ,  H01L2224/81951

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US20240094460A1

公开(公告)日：2024-03-21

申请号：US17949143

申请日：2022-09-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/30

CPC classification number: G02B6/12004 ,  G02B6/1228 ,  G02B6/305

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.

公开(公告)号：US20190204514A1

公开(公告)日：2019-07-04

申请号：US16298989

申请日：2019-03-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Tai-Hsuan TU ,  Yi-Min CHIN ,  Wei Lun WANG ,  Jia-Hao ZHANG

IPC: G02B6/42 ,  G02B6/255

CPC classification number: G02B6/4214 ,  G02B6/2552 ,  G02B6/305 ,  G02B6/4201 ,  G02B6/4204

Abstract: An optical device package includes: (1) a waveguide, the waveguide including: a main body; and multiple forks, wherein each of the plurality of forks has a tapering end and is extended from the main body, and wherein each of the tapering ends of the forks includes a facet for receiving light; and (2) an optical fiber having a surface configured to output the light into the waveguide; wherein a lateral distance between the surface of the optical fiber and at least one of the facets is less than about 25 micrometers (μm).

公开(公告)号：US20240411096A1

公开(公告)日：2024-12-12

申请号：US18208226

申请日：2023-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Sin-Yuan MU

IPC: G02B6/43

Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a first photonic component and an optical interposer. The optical interposer includes a plurality of optical paths and optically coupled to the first photonic component. The optical interposer is configured to switch between the optical paths for transmitting an optical signal from the first photonic component.

公开(公告)号：US20230081194A1

公开(公告)日：2023-03-16

申请号：US17472328

申请日：2021-09-10

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU ,  Jung Jui KANG

IPC: G02B6/43 ,  G02B6/42

Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.

公开(公告)号：US20220196918A1

公开(公告)日：2022-06-23

申请号：US17129644

申请日：2020-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/36 ,  G02B6/42 ,  G02B6/30

Abstract: An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.

公开(公告)号：US20190187371A1

公开(公告)日：2019-06-20

申请号：US16286364

申请日：2019-02-26

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Min CHIN ,  Yung-Shun CHANG ,  Mei-Ju LU ,  Jia-Hao ZHANG ,  Wen-Chi HUNG

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/00 ,  G02B6/12002 ,  G02B6/122 ,  G02B6/423 ,  G02B6/4239 ,  G02B2006/12123 ,  G02B2006/12147

Abstract: A semiconductor device package includes: (1) a substrate having a first surface; (2) a waveguide disposed in the substrate; and (3) an optical device including: (a) a first portion extending into the substrate and not extending beyond the first surface of the substrate, and (b) a second portion extending along the first surface of the substrate, wherein the second portion of the optical device comprises a protrusion and the substrate defines a groove extending from the first surface of the substrate, and wherein the protrusion of the second portion of the optical device engages with the groove of the substrate.

公开(公告)号：US20240379567A1

公开(公告)日：2024-11-14

申请号：US18780208

申请日：2024-07-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju LU ,  Jr-Wei LIN

IPC: H01L23/538 ,  H01L21/56 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

公开(公告)号：US20240019647A1

公开(公告)日：2024-01-18

申请号：US17866400

申请日：2022-07-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei LIN ,  Mei-Ju LU

IPC: G02B6/42

CPC classification number: G02B6/4231 ,  G02B6/4206

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.