公开(公告)号：US20190040527A1

公开(公告)日：2019-02-07

申请号：US15668632

申请日：2017-08-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chuan-Yung SHIH ,  Tai-Yuan HUANG ,  Yu-Chi WANG ,  Chin-Feng WANG ,  Sing-Syuan SHIAU ,  Chun-Wei SHIH ,  Shao-Ci HUANG ,  Huang-Hsien CHANG ,  Yuan-Feng CHIANG

IPC: C23C16/458 ,  H01L21/687 ,  H01L21/677

CPC classification number: C23C16/458 ,  C23C16/4404 ,  H01L21/02271 ,  H01L21/0262 ,  H01L21/28556 ,  H01L21/67126 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67748 ,  H01L21/68785

Abstract: In one or more embodiments, an apparatus for processing a wafer includes a ceramic wall, a metal wall and a frame. The ceramic wall defines a chamber for accommodating the wafer. The ceramic wall has a first surface defining a first opening. The metal wall surrounds the ceramic wall. The metal wall has a second surface defining a second opening adjacent to the first opening. The frame covers the second surface.