公开(公告)号：US20220328713A1

公开(公告)日：2022-10-13

申请号：US17227152

申请日：2021-04-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Chang Chin TSAI ,  Bo-Yu HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  H04B10/40 ,  H01L31/024 ,  H01L33/62 ,  H01L33/64

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US20200035851A1

公开(公告)日：2020-01-30

申请号：US16518792

申请日：2019-07-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Yu-Che HUANG ,  Hsun-Wei CHAN

IPC: H01L31/12

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

公开(公告)号：US20210257246A1

公开(公告)日：2021-08-19

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling MA ,  Ying-Chung CHEN ,  Hsin-Ying HO ,  Cheng-Ling HUANG ,  Chang Chin TSAI

IPC: H01L21/683 ,  H01L21/82 ,  H01L31/18 ,  H01L33/00

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

公开(公告)号：US20190267298A1

公开(公告)日：2019-08-29

申请号：US16282147

申请日：2019-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin Lin WU ,  Yu-Hsuan TSAI ,  Chang Chin TSAI ,  Lu-Ming LAI ,  Ching-Han HUANG

IPC: H01L23/20 ,  H01L23/043 ,  H01L23/053 ,  H01L23/10 ,  H01L23/26 ,  H01L21/48

Abstract: A semiconductor package structure includes a substrate, a semiconductor die, a lid and a cap. The semiconductor die is disposed on the substrate. The lid is disposed on the substrate. The cap is disposed on the lid. The substrate, the lid and the cap define a cavity in which the semiconductor die is disposed, and a pressure in the cavity is greater than an atmospheric pressure outside the cavity.

公开(公告)号：US20170294361A1

公开(公告)日：2017-10-12

申请号：US15094178

申请日：2016-04-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Hsun-Wei CHAN

IPC: H01L23/053 ,  H01L21/78 ,  H01L21/52 ,  H01L23/32

Abstract: A lid array panel includes multiple lids, where each lid includes an outer side wall. The lid array panel further includes a bridge section surrounding and attached to the outer side walls of the lids, where the lids are connected to each other by the bridge section, the lid array panel further includes a reinforcement attached to the bridge section. A package structure includes a carrier, a chip disposed on an upper surface of the carrier, a lid, a bridge section, and a reinforcement. The lid includes a top wall and an outer side wall, the top wall and the outer side wall of the lid together define a cavity, and the outer side wall of the lid is attached to the upper surface of the carrier. The bridge section surrounds, and is attached to, the outer side wall of the lid. The reinforcement is attached to the bridge section.

公开(公告)号：US20240170603A1

公开(公告)日：2024-05-23

申请号：US18427783

申请日：2024-01-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi WU ,  Chang Chin TSAI ,  Bo-Yu HUANG ,  Ying-Chung CHEN

IPC: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/64 ,  H04B10/40

CPC classification number: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/644 ,  H04B10/40

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US20220416111A1

公开(公告)日：2022-12-29

申请号：US17899552

申请日：2022-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Yu-Che HUANG ,  Hsun-Wei CHAN

IPC: H01L31/12

Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.

公开(公告)号：US20220139812A1

公开(公告)日：2022-05-05

申请号：US17088449

申请日：2020-11-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che HUANG ,  Chang Chin TSAI

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L21/56

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a carrier, a first encapsulant, and an interposer. The first encapsulant is on the carrier and defines a cavity. The interposer is disposed between the first encapsulant and the cavity. The first encapsulant covers a portion of the interposer.

公开(公告)号：US20190115505A1

公开(公告)日：2019-04-18

申请号：US16132206

申请日：2018-09-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin TSAI ,  Chun-Han CHEN ,  Hsin-Ying HO

IPC: H01L33/48 ,  H01S5/022 ,  H01S5/40 ,  H01L33/62 ,  H01L33/56

Abstract: A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.