公开(公告)号：US20230197487A1

公开(公告)日：2023-06-22

申请号：US18112466

申请日：2023-02-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Bo Hua CHEN ,  Yan Ting SHEN ,  Fu Tang CHU ,  Wen-Pin HUANG

IPC: H01L21/673 ,  H01L23/00 ,  H01L21/78

CPC classification number: H01L21/67346 ,  H01L23/562 ,  H01L21/78

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

公开(公告)号：US20210118806A1

公开(公告)日：2021-04-22

申请号：US16657882

申请日：2019-10-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hua TAI ,  Yueh-Ju LIN ,  Wen Shang CHANG ,  Wen-Pin HUANG

IPC: H01L23/538 ,  H01L23/31 ,  H01L23/552 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package includes a first carrier, a first electronic component, a second electronic component, a second carrier and an electrical connection structure. The first carrier has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface of the first carrier. The second electronic component is disposed on the second surface of the first carrier. The second carrier has a first surface facing the second surface of the first carrier and a second surface opposite to the first surface. The electrical connection structure is electrically connecting the first carrier with the second carrier

公开(公告)号：US20220102176A1

公开(公告)日：2022-03-31

申请号：US17060003

申请日：2020-09-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Bo Hua CHEN ,  Yan Ting SHEN ,  Fu Tang CHU ,  Wen-Pin HUANG

IPC: H01L21/673 ,  H01L21/78 ,  H01L23/00

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

公开(公告)号：US20220037244A1

公开(公告)日：2022-02-03

申请号：US16984120

申请日：2020-08-03

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hua TAI ,  Wen-Pin HUANG

IPC: H01L23/498 ,  H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H01L21/66 ,  H01L25/00 ,  H01L21/56

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first substrate and a second substrate. The first substrate has a first surface and a second surface opposite to the first surface of the first substrate. The second substrate has a first surface facing the first substrate and a second surface opposite to the first surface of the second substrate. The semiconductor device package also includes a first electronic component disposed on the first surface of the second substrate and electrically connected to the first surface of the second substrate. The semiconductor device package also includes a first encapsulant and a second encapsulant between the first substrate and the second substrate. The first encapsulant is different from the second encapsulant. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US20210391278A1

公开(公告)日：2021-12-16

申请号：US17461880

申请日：2021-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hua TAI ,  Pai-Chou LIU ,  Yun-Chih FEI ,  Wen-Pin HUANG ,  Sheng-Hong ZHENG

IPC: H01L23/552 ,  H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.

公开(公告)号：US20200335452A1

公开(公告)日：2020-10-22

申请号：US16388834

申请日：2019-04-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Li-Hua TAI ,  Pai-Chou LIU ,  Yun-Chih FEI ,  Wen-Pin HUANG ,  Sheng-Hong ZHENG

IPC: H01L23/552 ,  H01L23/13 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48

Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.