利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

224 条记录 (耗时 0.035 秒)

    Creating a system on the fly and applications thereof
    1.
    发明授权
    Creating a system on the fly and applications thereof 有权
    快速创建系统及其应用

    公开(公告)号：US08995931B2

    公开(公告)日：2015-03-31

    申请号：US12877938

    申请日：2010-09-08

    申请人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Sam Ziqun Zhao

    发明人： Ahmadreza (Reza) Rofougaran ,  Arya Reza Behzad ,  Michael Boers ,  Jesus Alfonso Castaneda ,  Sam Ziqun Zhao

    IPC分类号： H04B7/00 ,  G06F13/42 ,  H04B7/10 ,  G06F13/364 ,  H04W84/18

    CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

    摘要： Disclosed herein are systems, apparatuses, and methods for creating a system of wireless-enabled components (WECs). Such a system includes a server and a plurality of wireless-enabled component (WECs). Each WEC includes a functional resource (e.g., a processing resource and/or a memory resource) and is configured for wireless communication with the server and one or more other WECs. A first WEC is configured to wirelessly upload, to the server, an availability of the functional resource of the first WEC. The first WEC is further configured to wirelessly download, from the server, a linking resource for linking with one or more of the plurality of WECs. The plurality of WECs may be located on a single chip, on multiple chips of a single device, or on multiple chips of multiple devices.

    摘要翻译： 这里公开了用于创建无线组件（WEC）的系统的系统，设备和方法。 这样的系统包括服务器和多个无线使能组件（WEC）。 每个WEC包括功能资源（例如，处理资源和/或存储器资源），并且被配置用于与服务器和一个或多个其他WEC的无线通信。 第一WEC被配置为向服务器无线地上传第一WEC的功能资源的可用性。 第一WEC还被配置为从服务器无线地下载链接资源，用于与多个WEC中的一个或多个相关联。 多个WEC可以位于单个芯片上，在单个设备的多个芯片上，或者位于多个设备的多个芯片上。

    Proximity coupling without Ohmic contact and applications thereof
    2.
    发明授权
    Proximity coupling without Ohmic contact and applications thereof 有权
    没有欧姆接触的接近耦合及其应用

    公开(公告)号：US08351855B2

    公开(公告)日：2013-01-08

    申请号：US12877942

    申请日：2010-09-08

    申请人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Michael Boers ,  Ahmadreza Reza Rofougaran ,  Sam Ziqun Zhao

    发明人： Jesus Alfonso Castaneda ,  Arya Reza Behzad ,  Michael Boers ,  Ahmadreza Reza Rofougaran ,  Sam Ziqun Zhao

    IPC分类号： H04B5/00

    CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

    摘要： Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.

    摘要翻译： 本文公开了用于在没有欧姆接触的情况下提供接近耦合的系统，装置和方法。 这样的系统包括彼此无线耦合的多个无线功能组件（WEC）。 每个WEC包括金属基元件，衬底和将金属基元件与衬底分离的半导体层。 信号被配置为通过金属基元件和衬底之间的邻近耦合（例如，磁耦合，电耦合和/或电磁耦合）传输，而在金属基元件和衬底之间没有欧姆接触 基质。 在一个示例中，多个WEC的第一子集共同位于第一芯片上，并且多个WEC的第二子集共同位于第二芯片上。 第一芯片和第二芯片可以位于单个设备中或者位于单独的设备中。

    Proximity Coupling Without Ohmic Contact and Applications Thereof
    10.
    发明申请
    Proximity Coupling Without Ohmic Contact and Applications Thereof 有权
    没有欧姆接触的接近耦合及其应用

    公开(公告)号：US20110183610A1

    公开(公告)日：2011-07-28

    申请号：US12877942

    申请日：2010-09-08

    申请人： Jesus Alfonso CASTANEDA ,  Arya Reza Behzad ,  Michael Boers ,  Ahmadreza (Reza) Rofougaran ,  Sam Ziqun Zhao

    发明人： Jesus Alfonso CASTANEDA ,  Arya Reza Behzad ,  Michael Boers ,  Ahmadreza (Reza) Rofougaran ,  Sam Ziqun Zhao

    IPC分类号： H04B5/00

    CPC分类号： G06F9/50 ,  H04B5/0037 ,  H04B7/10 ,  H04B7/26 ,  H04W4/80 ,  H04W84/18 ,  Y10T307/492

    摘要： Disclosed herein are systems, apparatuses, and methods for providing a proximity coupling without Ohmic contact. Such a system includes a plurality of wireless-enabled components (WECs) that are wirelessly coupled to each other. Each WEC includes a metal-based element, a substrate, and a semiconductor layer that separates the metal-based element from the substrate. A signal is configured to be transmitted via a proximity coupling (e.g., a magnetic coupling, an electric coupling, and/or an electromagnetic coupling) between the metal-based element and the substrate without an Ohmic contact between the metal-based element and the substrate. In an example, a first subset of the plurality of the WECs is co-located on a first chip, and a second subset of the plurality of the WECs is co-located on a second chip. The first chip and the second chip may be located in a single device or in separate devices.

    摘要翻译： 本文公开了用于在没有欧姆接触的情况下提供接近耦合的系统，装置和方法。 这样的系统包括彼此无线耦合的多个无线功能组件（WEC）。 每个WEC包括金属基元件，衬底和将金属基元件与衬底分离的半导体层。 信号被配置为通过金属基元件和衬底之间的邻近耦合（例如，磁耦合，电耦合和/或电磁耦合）传输，而在金属基元件和衬底之间没有欧姆接触 基质。 在一个示例中，多个WEC的第一子集共同位于第一芯片上，并且多个WEC的第二子集共同位于第二芯片上。 第一芯片和第二芯片可以位于单个设备中或者位于单独的设备中。