摘要:
A toner supply bias voltage that is a vibrating voltage comprising an a.c. voltage and a d.c. voltage is applied to a toner supply roller. The d.c. voltage of toner supply bias voltage is changed in dependence upon a variation in the value of developing bias voltage. The lowering in the density at the leading end part of an image, the lowering in the density at the trailing end part of an image, and the uneven developing can be eliminated by satisfying the relationships100.ltoreq..vertline.VB.vertline..ltoreq..vertline.VSR.vertline.,2(.vertline.VSR-VB.vertline.+50).ltoreq..vertline.VPP.vertline..ltoreq.2.vertline.VSR.vertline. andf.gtoreq.v/lare satisfied, where VB is a developing bias voltage (unit: Volt), VSR is a d.c. voltage of the toner supply bias voltage (unit: Volt), VPP is a peak-to-peak value of the a.c. voltage (unit: Volt), f is a frequency (unit: Hz), v is a relative speed at the contact position between the developing roller 5 and the toner supply roller 6 (unit: mm/sec), and l is a nip width between the developing roller 5 and the toner supply roller 6 (unit: mm).
摘要:
A nonmagnetic single component developing device comprises a developing roller having an outer surface on which a layer of a nonmagnetic single component developer composed of nonmagnetic toner is formed, a toner supply roller arranged in rear of the developing roller and made into contact therewith, for agitating and supplying the toner, a toner regulating blade arranged above the developing roller and made into press-contact therewith, for regulating a volume of the toner. The toner supply roller is electroconductive, and is applied thereto with an a.c. voltage so as to prevent lowering of the density in the leading and trailing end parts of an image so as to obtain a uniform image characteristic.
摘要:
A developing apparatus includes a developing roller having a surface on which a layer of a non-magnetic single component developing agent (toner) is adapted to be formed, a toner supply roller held in contact with the developing roller so as to electrify the toner and also to supply the toner to the developing roller, and a toner regulating blade for regulating the toner on the developing roller so as to form a film of the toner thereon. The toner regulating blade is formed into a generally L-shape, and with a simple construction, the thickness of the toner layer, formed on the developing roller, can be stabilized, and also a torque of the developing roller can be reduced, and the degradation of a printed image is suppressed, thereby stabilizing the printed image.
摘要:
A developing apparatus has a toner reservoir for holding a non-magnetic toner, a toner supply roller including a supply surface for receiving the toner from the toner reservoir and electrifying the toner thereon, an electrostatic latent image carrier including a curved or flat latent image surface on which a latent image formed by an electrostatic voltage distribution thereon is developed by the toner transferred from the supply surface, and a toner seal surface arranged adjacent to the toner supply roller to contact a remaining part of the toner on the supply surface after the latent image development so that the remaining part of the toner is taken into the toner reservoir. The respective frictional coefficients between the toner seal surface and the toner and between the toner particles are selected to prevent a disturbance of toner condition between the toner and the toner seal surface.
摘要:
In a construction in which the intermediate stage 5 is interposed between the substrate positioning stage 4 and the electronic component supply stage 3; and in which it is possible to select either a mode of the bonding head 10A transferring to the substrate positioning stage 4 the electronic component P taken out of the electronic component supply stage 3 by the pickup head 6 and mounted on the intermediate stage 5 or a mode for transporting the electronic components, which has been taken directly out of the electronic component supply stage 3, to the substrate positioning stage 4 by means of the bonding head 10A, the pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of the beam member 8b of the gantry 8 positioned at the end of the base 2, and a space S that allows entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7.
摘要:
An aggregating agent injector (13) injects into raw water an aggregating agent for aggregating solids in raw water, a first aggregation aid injector (16) injects into raw water with the aggregating agent injected therein an aggregation aid for hardening or consolidating flocs formed by the aggregating agent, and a centrifugal separator (18) has a flocculator portion for causing raw water with the aggregation aid injected therein to whirl therein to flocculate solids in raw water, and a solid collector portion for causing raw water to swirl at higher speeds than in the flocculator portion to separate flocs from raw water.
摘要:
A part mounting apparatus of the invention comprises: a pickup head having a pickup tool for picking up a part; a pickup head supporting unit for supporting the pickup head; a pickup head supporting arm having one end portion where the pickup head is disposed and an other end portion rotatably mounted to the pickup head supporting unit; a pickup head inverting unit for vertically inverting the pickup head with respect to the pickup head supporting unit; and a pickup tool rotating unit for rotating the pickup tool about a rotational axis of the pickup tool, wherein the pickup tool rotating unit includes driving force generating unit and driving force transmitting unit for transmitting a driving force of the driving force generating unit as a rotational force of the pickup tool, and the driving force generating unit is disposed on the pickup head supporting unit.
摘要:
Provided is a component mounting device and a component mounting method in which three stages, i.e. a component supply stage, a component intermediate stage and a component mounting stage are disposed properly to achieve efficient movement of a pickup head and a mounting head to thereby improve production efficiency.The component mounting device includes: a pickup head 5 which picks up a chip 4 from a wafer sheet holder 2; a chip intermediate table 6 on which the picked-up chip 4 is temporarily placed; a mounting head 7 which receives the chip 4 temporarily placed on the chip intermediate table 6; and a board support table 9 on which the chip 4 received by the mounting head 7 is mounted on a board 8; wherein: the chip intermediate table 6 is disposed at a height between the wafer sheet holder 2 and the board support table 9 to keep the balance between moving times of the pickup head 5 and the mounting head 7.
摘要:
A component mounting apparatus 1 for mounting a semiconductor chip 6a picked from a component feeding stage 3 to a substrate 7 is configured so as to have a second head 12 for subjecting the substrate 7 or the semiconductor chip 6a loaded on the substrate 7 by a first head 11 to predetermined operation in addition to having the first head 11 equipped with a loading unit 19 that loads the semiconductor chip 6a on the substrate 7. The second head 12 is configured in such a way that the second head 12 can selectively be equipped with, in addition to a coating unit 20 for squiring paste for component bonding purpose from a coating nozzle, a work unit having at least one of a paste transfer function for transferring paste by means of a transfer tool, to thus supply paste to the substrate and a heating-press function for pressing the component loaded on the substrate against the substrate while heating the component.
摘要:
In a construction in which the intermediate stage 5 is interposed between the substrate positioning stage 4 and the electronic component supply stage 3; and in which it is possible to select either a mode of the bonding head 10A transferring to the substrate positioning stage 4 the electronic component P taken out of the electronic component supply stage 3 by the pickup head 6 and mounted on the intermediate stage 5 or a mode for transporting the electronic components, which has been taken directly out of the electronic component supply stage 3, to the substrate positioning stage 4 by means of the bonding head 10A, the pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of the beam member 8b of the gantry 8 positioned at the end of the base 2, and a space S that allows entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7.