公开(公告)号：US07584853B2

公开(公告)日：2009-09-08

申请号：US11313620

申请日：2005-12-22

申请人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Tooru Suda ,  Tsuyoshi Takashima ,  Yasushi Izumibe

发明人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Tooru Suda ,  Tsuyoshi Takashima ,  Yasushi Izumibe

IPC分类号： B65D85/00

CPC分类号： H05K13/0084 ,  Y10S206/813

摘要： The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.

摘要翻译： 本发明是一种电子部件系列，其包括载带，该载带具有沿着长度方向周期布置的多个存储凹部，要存储在多个存储凹部中的电子部件，覆盖多个存储凹部的盖带 的载带，以及粘合到载带和盖带的一对粘合区域，并且沿着载带的纵向方向延伸以便从两侧包围多个存储凹部，其中粘合宽度 一对粘合剂区域分别相应于储存凹槽的尺寸周期性地增加。 利用该电子部件系列，可以充分降低第一粘合区域和第二粘合区域之间的覆盖带的剥离强度的差异。

公开(公告)号：US20060138019A1

公开(公告)日：2006-06-29

申请号：US11313620

申请日：2005-12-22

申请人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Tooru Suda ,  Tsuyoshi Takashima ,  Yasushi Izumibe

发明人： Akitoshi Yoshii ,  Taisuke Ahiko ,  Tooru Suda ,  Tsuyoshi Takashima ,  Yasushi Izumibe

IPC分类号： B65D85/00

CPC分类号： H05K13/0084 ,  Y10S206/813

摘要： The present invention is an electronic component series, comprising a carrier tape which has a plurality of storage recesses cyclically arranged along the longitudinal direction, electronic components to be stored in the plurality of storage recesses, a cover tape established to cover the plurality of storage recesses of the carrier tape, and a pair of adhesive regions which adhere to the carrier tape and to the cover tape, and extend along the longitudinal direction of the carrier tape so as to enclose the plurality of storage recesses from both sides, wherein the adhesive width of the pair of adhesive regions is cyclically increased in size corresponding to the storage recesses respectively. With this electronic component series, the difference in the peel strength of the cover tape between the first adhesive regions and the second adhesive regions can be sufficiently reduced.

公开(公告)号：US08044504B2

公开(公告)日：2011-10-25

申请号：US12553182

申请日：2009-09-03

申请人： Tooru Suda

发明人： Tooru Suda

IPC分类号： H01L23/12

CPC分类号： H01L23/3735 ,  H01L23/49838 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device, includes: an organic multilayer wiring substrate having an inner conductive layer; a semiconductor element mounted and connected on one surface of the wiring substrate; and a plurality of solder balls disposed on the other surface in a grid array. A defect portion is formed at an area corresponding to a corner solder ball disposed at an outer peripheral corner, or at an area corresponding to the corner solder ball and peripheral solder balls at the inner conductive layer. Temperature rises of the solder balls disposed in a vicinity of the corner are suppressed, and therefore, the semiconductor device of which fatigue life is prolonged and superior in reliability can be obtained.

摘要翻译： 一种半导体器件，包括：具有内部导电层的有机多层布线基板; 安装并连接在所述布线基板的一个表面上的半导体元件; 以及以栅格阵列设置在另一表面上的多个焊球。 缺陷部形成在与设置在外周角部的角焊球或与内导电层处的角焊球和外周焊球对应的区域的区域。 抑制了设置在拐角附近的焊球的温度上升，因此可以获得疲劳寿命延长，可靠性优异的半导体装置。

公开(公告)号：US20100096751A1

公开(公告)日：2010-04-22

申请号：US12553182

申请日：2009-09-03

申请人： Tooru Suda

发明人： Tooru Suda

IPC分类号： H01L23/498

CPC分类号： H01L23/3735 ,  H01L23/49838 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device, includes: an organic multilayer wiring substrate having an inner conductive layer; a semiconductor element mounted and connected on one surface of the wiring substrate; and a plurality of solder balls disposed on the other surface in a grid array. A defect portion is formed at an area corresponding to a corner solder ball disposed at an outer peripheral corner, or at an area corresponding to the corner solder ball and peripheral solder balls at the inner conductive layer. Temperature rises of the solder balls disposed in a vicinity of the corner are suppressed, and therefore, the semiconductor device of which fatigue life is prolonged and superior in reliability can be obtained.

摘要翻译： 一种半导体器件，包括：具有内部导电层的有机多层布线基板; 安装并连接在所述布线基板的一个表面上的半导体元件; 以及以栅格阵列设置在另一表面上的多个焊球。 缺陷部形成在与设置在外周角部的角焊球或与内导电层处的角焊球和外周焊球对应的区域的区域。 抑制了设置在拐角附近的焊球的温度上升，因此可以获得疲劳寿命延长，可靠性优异的半导体装置。