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1.发明申请CARBOTHERMAL REDUCTION REACTOR SYSTEM, COMPONENTS THEREOF, AND METHODS OF USING SAME 审中-公开碳热还原反应器系统及其组件及其使用方法公开(公告)号：US20160208362A1
公开(公告)日：2016-07-21
申请号：US14915573
申请日：2014-08-28
申请人： Alan W. WEIMER , Aaron PALUMBO
发明人： Alan W. Weimer , Aaron Palumbo
CPC分类号： C22B26/22 , B01D53/002 , C01B21/06 , C01B21/0685 , C01B21/0726 , C22B1/14 , C22B5/10 , C22B5/16 , C22B19/20
摘要： Methods, systems, and components suitable for carbothermal reduction processes are disclosed. Exemplary systems include a reactor, such as hybrid solarthermal-electric reactor, a solar thermal reactor, an electric reactor, or a reactor heated by gas combustion, a pellet source, a gas reactant source, and a vacuum source. The reactor can operate as a moving bed or pseudo moving bed reactor.
摘要翻译： 公开了适用于碳热还原工艺的方法，系统和组件。 示例性系统包括反应器，例如混合式热电反应堆，太阳能热反应器，电反应器或由气体燃烧加热的反应器，颗粒源，气体反应物源和真空源。 反应器可以作为移动床或伪移动床反应器操作。
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公开(公告)号：US06411516B1
公开(公告)日：2002-06-25
申请号：US09882479
申请日：2001-06-15
申请人： Aaron Palumbo , Alex Toh , Abhay Umdekar
发明人： Aaron Palumbo , Alex Toh , Abhay Umdekar
IPC分类号： H05K720
CPC分类号： H05K1/0204 , H01L23/3677 , H01L2924/0002 , H05K3/341 , H05K2201/09781 , H05K2201/10416 , Y10T29/49353 , H01L2924/00
摘要： A printed circuit board assembly includes a printed circuit board, with a first side and a second side and at least one opening formed therebetween. The opening has a slug at least partially disposed therein and attached to the first side. The second side of the circuit board has a hot component positioned thereon and overlying the opening. A solder joint is formed between the slug and the hot component to allow dissipation of heat from the hot component.
摘要翻译： 印刷电路板组件包括印刷电路板，其具有第一侧和第二侧以及在其间形成的至少一个开口。 开口具有至少部分地设置在其中并附接到第一侧的块塞。 电路板的第二侧具有定位在其上并覆盖开口的热部件。 在焊料和热部件之间形成焊接接头以允许从热部件散热。
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公开(公告)号：USD440953S1
公开(公告)日：2001-04-24
申请号：US29130429
申请日：2000-10-02
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