HEAT SINK WITH STAGGERED HEAT EXCHANGE ELEMENTS
    2.
    发明申请
    HEAT SINK WITH STAGGERED HEAT EXCHANGE ELEMENTS 审中-公开
    散热与热交换元件

    公开(公告)号:US20140151012A1

    公开(公告)日:2014-06-05

    申请号:US14176979

    申请日:2014-02-10

    Abstract: A heat sink comprising a base, a first row of metal fins and a second row of wedge-shaped vortex generators. The first row of metal fins can be connected to and raised above a surface of the base, long dimensions of the metal fins being substantially parallel to each other and to the surface. The second row of wedge-shaped vortex generators can be connected to and raised above the base, each of the wedge-shaped vortex generators having a long dimension that is substantially parallel to the long dimensions of others of the wedge-shaped vortex generators and to the surface. The first and second rows can be substantially opposed to each other such that first ends of the metal fins are staggered with respect to first ends of the wedge-shaped vortex generators.

    Abstract translation: 一种散热器,包括基座,第一排金属翅片和第二排楔形涡流发生器。 金属翅片的第一排可以连接到基座的表面上并在其上方升高,金属翅片的长尺寸基本上彼此平行并且与表面平行。 楔形涡流发生器的第二排可以连接到基座上并在其上方升高,每个楔形涡流发生器具有基本上平行于楔形涡流发生器的其它长度的长尺寸的长尺寸, 表面。 第一和第二排可以基本上彼此相对,使得金属翅片的第一端相对于楔形涡流发生器的第一端交错排列。

    COOLING ARRANGEMENT FOR A CIRCUIT PACK
    5.
    发明申请
    COOLING ARRANGEMENT FOR A CIRCUIT PACK 审中-公开
    电路组的冷却装置

    公开(公告)号:US20160066469A1

    公开(公告)日:2016-03-03

    申请号:US14472684

    申请日:2014-08-29

    CPC classification number: G02B6/4269 H04Q1/035

    Abstract: A circuit structure comprises a circuit board. An array of opto-electronic devices is provided on the circuit board. At least some of heat sinks are provided in thermal contact with a respective opto-electronic device. A face plate of the circuit structure comprises an array of openings configured to allow air to move along a path adjacent to an opto-electronic device and through a respective heat sink. An air moving device is located adjacent a heat sink and is operable to drive air through a respective opening on the face plate. A ducting structure is provided to direct the air driven by a corresponding air moving device.

    Abstract translation: 电路结构包括电路板。 在电路板上提供了一系列光电器件。 至少一些散热器被提供与相应的光电器件热接触。 电路结构的面板包括开口阵列,其被配置为允许空气沿着与光电装置相邻的路径移动并且通过相应的散热器。 空气移动装置位于散热器附近,并且可操作地驱动空气通过面板上的相应开口。 提供管道结构来引导由相应的空气移动装置驱动的空气。

    COOLING TECHNIQUE
    6.
    发明申请
    COOLING TECHNIQUE 审中-公开
    冷却技术

    公开(公告)号:US20140209288A1

    公开(公告)日:2014-07-31

    申请号:US13751824

    申请日:2013-01-28

    CPC classification number: F28F27/02 F25B23/006 H05K7/20836

    Abstract: A method and an apparatus are provided for cooling a heat source using a refrigerant flow in a heat exchanger. According to some embodiments, a flow property of the refrigerant as it flows through a heat exchanger is measured and based on the measurement a flow distribution rate for the flow of the refrigerant in the heat exchanger is determined. A valve is operated for adjusting the flow rate of the refrigerant in the heat exchanger according to the determined flow distribution rate.

    Abstract translation: 提供了一种用于在热交换器中使用制冷剂流来冷却热源的方法和装置。 根据一些实施例,测量制冷剂流过热交换器时的流动特性,并且基于测量,确定热交换器中的制冷剂流动的流量分布速率。 操作阀,根据确定的流量分配率来调节热交换器中制冷剂的流量。

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