公开(公告)号：US20120161209A1

公开(公告)日：2012-06-28

申请号：US13039762

申请日：2011-03-03

申请人： Ali Yazdani ,  N. Phuan Ong ,  Robert J. Cava

发明人： Ali Yazdani ,  N. Phuan Ong ,  Robert J. Cava

IPC分类号： H01L29/78 ,  H01B5/00 ,  H01L21/70 ,  H01L25/00

CPC分类号： H01L23/53209 ,  C22C28/00 ,  C22C30/00 ,  H01L21/76838 ,  H01L23/53271 ,  H01L29/78 ,  H01L29/78681 ,  H01L2924/0002 ,  H01L2924/01051 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

摘要翻译： 公开了具有增强的电导率对缺陷的免疫性的互连。 互连包括具有拓扑表面状态的电荷载体的材料。 还公开了制造这种互连的方法。 还公开了包括这种互连的集成电路。 还公开了一种门控电子器件，其包括具有拓扑表面状态的电荷载体的材料。

公开(公告)号：US09331020B2

公开(公告)日：2016-05-03

申请号：US13039762

申请日：2011-03-03

申请人： Ali Yazdani ,  N. Phuan Ong ,  Robert J. Cava

发明人： Ali Yazdani ,  N. Phuan Ong ,  Robert J. Cava

IPC分类号： H01L29/76 ,  H01L23/532 ,  H01L29/786 ,  H01L21/768 ,  C22C28/00 ,  C22C30/00 ,  H01L29/78

CPC分类号： H01L23/53209 ,  C22C28/00 ,  C22C30/00 ,  H01L21/76838 ,  H01L23/53271 ,  H01L29/78 ,  H01L29/78681 ,  H01L2924/0002 ,  H01L2924/01051 ,  Y10T29/49204 ,  H01L2924/00

摘要： An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

摘要翻译： 公开了具有增强的电导率对缺陷的免疫性的互连。 互连包括具有拓扑表面状态的电荷载体的材料。 还公开了制造这种互连的方法。 还公开了包括这种互连的集成电路。 还公开了一种门控电子器件，其包括具有拓扑表面状态的电荷载体的材料。