公开(公告)号：US4808434A

公开(公告)日：1989-02-28

申请号：US102696

申请日：1987-09-30

申请人： Reginald B. P. Bennett ,  Allan R. Drake ,  Roger C. Finn

发明人： Reginald B. P. Bennett ,  Allan R. Drake ,  Roger C. Finn

IPC分类号： H05K1/09 ,  H05K3/24 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  B05D3/06 ,  B05D5/12

CPC分类号： H05K3/3484 ,  H05K3/247 ,  H05K3/4664 ,  H05K3/4685 ,  H05K1/095 ,  H05K2201/0305 ,  H05K2201/035 ,  H05K2203/043 ,  H05K3/4038

摘要： The invention provides a method of applying an overlay conductor between at least a pair of connection land areas on a surface of a printed circuit board. The pattern of the conductor is first defined by the application of a dielectric material between the pair of land areas. A silver polymer ink is then applied over the dielectric material and over only a portion of each land area. The polymer ink is then cured by exposure to a source of heat. The pair of land areas and at least the portion of the cured ink overlaying the land areas are then covered with silver solder paste which is subsequently reflowed by exposure to a source of heat and allowed to solidify thereby attaching the conductor to the land area and providing a secure conductive connection.

摘要翻译： 本发明提供一种在印刷电路板的表面上的至少一对连接区域之间施加覆盖导体的方法。 导体的图案首先通过在一对接地区域之间施加电介质材料来定义。 然后将银聚合物油墨施加在电介质材料上并且仅在每个焊盘区域的一部分上。 然后通过暴露于热源来固化聚合物油墨。 该对地面区域和至少覆盖在陆地区域上的固化油墨的部分然后用银焊膏覆盖，银焊膏随后通过暴露于热源而被回流并允许固化，从而将导体附着到陆地区域并提供 一个安全的导电连接。

公开(公告)号：US4762732A

公开(公告)日：1988-08-09

申请号：US101538

申请日：1987-09-28

申请人： Allan R. Drake ,  Roger C. Finn ,  Reginald B. P. Bennett

发明人： Allan R. Drake ,  Roger C. Finn ,  Reginald B. P. Bennett

IPC分类号： G03F7/004 ,  H05K1/09 ,  H05K3/24 ,  H05K3/34 ,  B05D3/06

CPC分类号： H05K3/247 ,  G03F7/0047 ,  H05K1/095 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2203/043

摘要： The invention provides a process for forming an electrical conductor pattern on desired areas of a substrate comprising the steps of applying a predetermined pattern of silver polymer ink on the substrate and at least partially curing it. A layer of silver solder paste is then applied over the cured polymer ink to a width larger than that of the ink. The solder paste is then reflowed and allowed to solidify, whereby the silver polymer ink becomes encapsulated in the reflowed silver solder to form the desired pattern of conductors which may then be covered with a layer of dielectric material comprising a cured non-conductive polymer ink.

摘要翻译： 本发明提供了一种在衬底的期望区域上形成电导体图案的方法，包括以下步骤：在衬底上施加预定图案的银聚合物油墨并且至少部分地固化。 然后将一层银焊膏施加在固化的聚合物油墨上，其宽度大于油墨的宽度。 然后将焊膏回流并使其固化，由此银聚合物油墨被包封在回流的银焊料中以形成期望的导体图案，然后可以用包含固化的非导电聚合物油墨的介电材料层覆盖。

公开(公告)号：USD263054S

公开(公告)日：1982-02-16

申请号：US49201

申请日：1979-06-18

申请人： Reginald B. P. Bennett

设计人： Reginald B. P. Bennett