公开(公告)号：US12084583B2

公开(公告)日：2024-09-10

申请号：US17524891

申请日：2021-11-12

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Jayaprakash Sundaramurthy ,  Siuli Sarkar ,  Ravindra M. Bhatkal

IPC: C09D11/322 ,  B41F15/40 ,  B41M5/00 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/03 ,  H05K3/00 ,  C09D11/30

CPC classification number: C09D11/322 ,  B41F15/40 ,  B41M5/0023 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/0393 ,  H05K3/0011 ,  C09D11/30 ,  H05K2201/0133 ,  C09D11/10 ,  C09D11/52

Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

公开(公告)号：US11193031B2

公开(公告)日：2021-12-07

申请号：US16613344

申请日：2018-05-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Jayaprakash Sundaramurthy ,  Siuli Sarkar ,  Ravindra M. Bhatkal

IPC: C09D11/322 ,  B41F15/40 ,  B41M5/00 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/03 ,  H05K3/00 ,  C09D11/30

Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.