公开(公告)号：US4524497A

公开(公告)日：1985-06-25

申请号：US565438

申请日：1984-02-15

Applicant: Gary M. Rapps ,  Alvin Feder

Inventor： Gary M. Rapps ,  Alvin Feder

IPC: H01L41/04 ,  H03H9/05 ,  H01L41/22

CPC classification number: H03H9/1014 ,  H01L41/04 ,  H03H9/0504 ,  Y10T29/42 ,  Y10T29/49171

Abstract: A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.

Abstract translation: 可以实现从晶体板的电极图案到端子柱的引线接合操作的低剖面晶体封装，而不用担心晶体板本身的断裂。 晶体坯料位于支撑构件上，该支撑构件又最初位于铟环上。 在该位置，晶体坯料不与顶表面被铟糊料覆盖的分裂中心支撑柱接触，并且在引线接合期间围绕其周边支撑。 当所有的引线接合操作被实现时，组件受到足够的热量，其中铟材料将熔化，这将导致支撑构件向下拉，从而导致晶体板仅被中心支撑件支撑和固定， 其结晶板的周边可自由振动，无外部阻尼支撑。

公开(公告)号：US4081631A

公开(公告)日：1978-03-28

申请号：US748616

申请日：1976-12-08

Applicant: Alvin Feder

Inventor： Alvin Feder

IPC: G06F3/02 ,  H01H13/702 ,  H01H13/785 ,  H01H13/84 ,  H01H9/00 ,  G10K10/00

CPC classification number: H01H13/785 ,  H01H13/702 ,  H01H13/84 ,  H01H2201/032 ,  H01H2223/002 ,  H01H2223/04 ,  H01H2239/034 ,  H01H2239/048

Abstract: An improved data terminal utilizing tactile switch assemblies with specialized sound apertures provide reduced panel space requirements and indirect sound paths for miniature electronic apparatus. A maximum number of switches can be accommodated on the instrument panel with no separate speaker/microphone grille required. Non-aligned sound apertures provide maximal weather protection for speaker and microphone mounted behind the switch assembly panel. The switch assembly design seals off the remainder of the unit from weather or dust damage.

公开(公告)号：US4453104A

公开(公告)日：1984-06-05

申请号：US377289

申请日：1982-05-12

Applicant: Gary M. Rapps ,  Alvin Feder

Inventor： Gary M. Rapps ,  Alvin Feder

IPC: H03H9/05 ,  H01L41/08

CPC classification number: H03H9/0504

Abstract: A low-profile crystal package wherein the wire bonding operation from the electrode pattern of the crystal plate to the terminal posts may be accomplished without fear of fracture of the crystal plate itself. The crystal blank is positioned on a support member which in turn initially sits on a ring of indium. In this position, the crystal blank is not in contact with the split center support post whose top surface is covered with indium paste, and is supported around its periphery during wire bonding. When all the wire bonding operations are effectuated, the assembly is subjected to sufficient heat wherein the indium material will melt, which will cause the support member to be drawn downward, thereby resulting in the crystal plate being supported and fastened only by the center supports, with the periphery of the crystal plate being free to vibrate with no extraneous dampened support.

Abstract translation: 可以实现从晶体板的电极图案到端子柱的引线接合操作的低剖面晶体封装，而不用担心晶体板本身的断裂。 晶体坯料位于支撑构件上，该支撑构件又最初位于铟环上。 在该位置，晶体坯料不与顶表面被铟糊料覆盖的分裂中心支撑柱接触，并且在引线接合期间围绕其周边支撑。 当所有的引线接合操作被实现时，组件受到足够的热量，其中铟材料将熔化，这将导致支撑构件向下拉，从而导致晶体板仅被中心支撑件支撑和固定， 其结晶板的周边可自由振动，无外部阻尼支撑。

公开(公告)号：US4373119A

公开(公告)日：1983-02-08

申请号：US213425

申请日：1980-12-05

Applicant: Alvin Feder

Inventor： Alvin Feder

IPC: H04R1/22 ,  H04R17/00

CPC classification number: H04R1/22 ,  H04R17/00

Abstract: An adjustable transducer apparatus includes a transducer fixedly mounted on a metal plate, a saucer-shaped housing with a pair of concentric inner ridges, a planar annular cover plate, the rim of which rests of the outer ridge, a transducer element fixedly mounted on a metal plate, the rim of the metal plate resting on the inner edge, an "O" ring disposed in the housing between the cover plate and the metal plate for cushioning the metal plate against the housing, and a plurality of screws for adjustably fastening the cover plate against the housing so that the cover plate is pivoted about the outer ridge to produce a compression on the "O" ring, and that said "O" ring in turn holds the metal plate in place in the housing. The maximum alertness of the transducer is obtained by adjusting the screws and thereby adjusting the chamber formed by the housing and the planar annular cover plate.

Abstract translation: 一种可调节换能器装置，包括固定安装在金属板上的传感器，具有一对同心内脊的碟形壳体，平面环形盖板，其外缘的其余部分的边缘，固定安装在 金属板，金属板的边缘搁置在内边缘上，在盖板和金属板之间设置的“O”环，用于将金属板抵靠壳体缓冲，以及多个螺钉，用于可调节地紧固 盖板抵靠壳体，使得盖板围绕外脊枢转以在“O”形环上产生压缩，并且所述“O”形圈依次将金属板保持在壳体中的适当位置。 传感器的最大警戒性是通过调节螺丝，从而调节由外壳和平面环形盖板形成的腔室。

公开(公告)号：US4292562A

公开(公告)日：1981-09-29

申请号：US35373

申请日：1979-05-03

Applicant: Alvin Feder

Inventor： Alvin Feder

IPC: H01L41/053 ,  H03H9/05 ,  H01L41/08

CPC classification number: H03H9/0514 ,  H01L41/053

Abstract: A crystal plate is mounted on a pedestal area of an inverted bridge structure positioned within a depressed area of a crystal carrier. The plate is supported on the upper surface of the carrier until the wire bonding process is complete, then the ends of the bridge are forced down against support pins on the carrier and are welded into place. As the ends of the bridge are forced down, the center portion of the bridge is raised, elevating the crystal plate above the carrier surface for free vibration.

Abstract translation: 晶体板安装在位于晶体载体的凹陷区域内的倒置桥结构的基座区域上。 板被支撑在载体的上表面上，直到引线接合过程完成，然后将桥的端部向下压靠在载体上的支撑销上并被焊接到位。 当桥的端部被迫下降时，桥的中心部分升高，将晶片升高到载体表面上方以自由振动。

公开(公告)号：US4114000A

公开(公告)日：1978-09-12

申请号：US800245

申请日：1977-05-25

Applicant: Alvin Feder

Inventor： Alvin Feder

IPC: H01H1/029 ,  H01H15/00 ,  H01H15/02 ,  H01H1/02

CPC classification number: H01H1/029 ,  H01H15/005

Abstract: A three position switch which selectively interconnects isolated conductors on a printed circuit board is disclosed. In one embodiment, pressure sensitive conductive elastomer pads, disposed in the switch, are brought into contact with isolated conductors on a substrate. A sliding switch actuator, having a cam surface with indentations, is then used to selectively apply pressure to the conductive elastomer pads and thereby selectively connect the isolated printed circuit board conductors. In another embodiment, a three position switch is shown including a plurality of conductive pads, flexibly attached to a switch casing, which are positioned above printed circuit board isolated conductors and then selectively flexed downward into contact with the printed circuit board conductors by moving a sliding actuator arm having a cam surface. The conductive pads are normally separated from the printed circuit board conductors by a flexible rubber shoulder which forms a seal around the contact area and is flexed outward while maintaining the seal when the conductive pads are flexed into contact with the printed circuit board conductors.