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    Smartcards with multiple coupling frames
    2.
    发明授权
    Smartcards with multiple coupling frames 有权

    公开(公告)号：US11354560B2

    公开(公告)日：2022-06-07

    申请号：US17006795

    申请日：2020-08-29

    Applicant: AMATECH GROUP LIMITED

    Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

    IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16 ,  H01F27/28 ,  H05K3/10 ,  H01F38/14

    Abstract: RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

    SMARTCARDS WITH MULTIPLE COUPLING FRAMES
    3.
    发明申请
    SMARTCARDS WITH MULTIPLE COUPLING FRAMES 有权

    公开(公告)号：US20220138522A1

    公开(公告)日：2022-05-05

    申请号：US17579124

    申请日：2022-01-19

    Applicant: AmaTech Group Limited

    Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

    IPC: G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16

    Abstract: RFID devices comprising (i) a transponder chip module (TCM) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE
    5.
    发明申请
    SMART CARDS WITH METAL LAYER(S) AND METHODS OF MANUFACTURE 有权

    公开(公告)号：US20210256341A1

    公开(公告)日：2021-08-19

    申请号：US17228712

    申请日：2021-04-13

    Applicant: AmaTech Group Limited

    Inventor： Mustafa Lotya ,  Darren Molloy ,  David Finn

    IPC: G06K19/077 ,  G06K19/07

    Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.

    Manufacturing metal inlays for dual interface metal cards
    6.
    发明授权
    Manufacturing metal inlays for dual interface metal cards 有权

    公开(公告)号：US11928537B2

    公开(公告)日：2024-03-12

    申请号：US17752051

    申请日：2022-05-24

    Applicant: AmaTech Group Limited

    Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

    IPC: G06K19/077 ,  H01Q1/22

    CPC classification number: G06K19/07722 ,  G06K19/07745 ,  H01Q1/2225

    Abstract: A “core” or “inlay” for a smartcard may comprise a first metal layer and a second metal layer, and may be formed by folding a single metal layer upon itself. A module cavity may be formed in the first metal layer by laser cutting, prior to laminating. An adhesive layer may be disposed between the two metal layers. A module opening may be formed in the second metal layer by milling, after laminating the first metal layer to the second metal layer. A slit in a metal layer may extend from an outer edge of the layer to the cavity or opening, thereby forming a coupling frame. The slit may have a termination hole at either end or at both ends of the slit. The slits of two metal layers may be positioned differently than one another.

    Metal-containing dual interface smartcards
    7.
    发明授权
    Metal-containing dual interface smartcards 有权

    公开(公告)号：US11645487B2

    公开(公告)日：2023-05-09

    申请号：US17544603

    申请日：2021-12-07

    Applicant: AmaTech Group Limited ,  Federal Card Services, LLC

    Inventor： Mustafa Lotya

    IPC: G06K19/02 ,  G06K19/07

    CPC classification number: G06K19/02 ,  G06K19/0723

    Abstract: Smartcard (SC) having a metal card body (MCB) which is a coupling frame (CP) with a slit (S), and a coupling loop antenna/structure (CLA, CLS) connected to termination points (TP) on each side of the slit (S) and coupled with the module antenna (MA) of a transponder chip module (TCM). A portion of the card body (CB) may be metal and another, coplanar portion of the card body may be a synthetic material which may be transparent or translucent. Currents may be collected from the interface between the two portions. The card body (CB) may have two metal layers of different materials, adhesively joined to each other using a thermosetting epoxy that converts from B-stage to C-stage during lamination.

    Contactless metal card constructions
    8.
    发明授权
    Contactless metal card constructions 有权

    公开(公告)号：US11514288B2

    公开(公告)日：2022-11-29

    申请号：US16944184

    申请日：2020-07-31

    Applicant: AMATECH GROUP LIMITED

    Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

    IPC: G06K19/06 ,  G06K19/077

    Abstract: A metal smartcard (SC) having a transponder chip module (TCM) with a module antenna (MA), and a card body (CB) comprising two discontinuous metal layers (ML), each layer having a slit (S) overlapping the module antenna, the slits being oriented differently than one another. One metal layer can be a front card body (FCB, CF1), and the other layer may be a rear card body (RCB, CF2) having a magnetic stripe (MS) and a signature panel (SP). The slits in the metal layers may have non-linear shapes.

    Smartcard constructions and methods
    9.
    发明授权
    Smartcard constructions and methods 有权

    公开(公告)号：US11037044B2

    公开(公告)日：2021-06-15

    申请号：US16826322

    申请日：2020-03-23

    Applicant: AMATECH GROUP LIMITED

    Inventor： Mustafa Lotya ,  David Finn ,  Darren Molloy

    IPC: G06K19/06 ,  G06K19/077 ,  H01Q1/22 ,  H01Q21/29 ,  H01Q7/00 ,  H05K1/16 ,  H05K3/10 ,  H01F38/14 ,  H01F27/28

    Abstract: Smartcards having (i) a metal card body (MCB) with a slit (S) overlapping a module antenna (MA) of a chip module (TCM) or (ii) multiple metal layers (M1, M2, M3) each having a slit (S1, S2, S3) offset from or oriented differently than each other. A front metal layer may be continuous (no slit), and may be shielded from underlying metal layers by a shielding layer (SL). Metal backing inserts (MBI) reinforcing the slit(s) may also have a slit (S2) overlapping the module antenna. Diamond like carbon coating filling the slit. Key fobs similarly fabricated. Smart cards with metal card bodies (MCB). Plastic-Metal-Plastic smartcards and methods of manufacture are disclosed. Such cards may be contactless only, contact only, or may be dual-interface (contact and contactless) cards.

    SMARTCARD WITH A COUPLING FRAME AND A WIRELESS CONNECTION BETWEEN MODULES
    10.
    发明申请
    SMARTCARD WITH A COUPLING FRAME AND A WIRELESS CONNECTION BETWEEN MODULES 有权

    公开(公告)号：US20230136903A1

    公开(公告)日：2023-05-04

    申请号：US17881979

    申请日：2022-08-05

    Applicant: AmaTech Group Limited

    Inventor： Mustafa Lotya ,  David Finn

    IPC: G06K19/07

    Abstract: A wireless connection is established between at least two electronic modules (M1, M2) disposed separate from one another in a smartcard having a coupling frame so that the two modules may communicate (signals, data) with each other. The two modules may each have module antennas (MA-1, MA-2), and may be disposed in respective two openings (MO-1, MO-2) of a coupling frame (CF). A coupling antenna (CPA) having two coupler coils (CC-1, CC-2) disposed close to the two modules antennas of the two modules. The coupling antenna may have only the two coupler coils (CC-1, CC-2), connected with one another, without the peripheral card antenna (CA) component of a conventional booster antenna (BA). Energy harvesting is disclosed.

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