公开(公告)号：US20180310397A1

公开(公告)日：2018-10-25

申请号：US15956945

申请日：2018-04-19

申请人： Oclaro Japan, Inc.

发明人： Daisuke NOGUCHI ,  Hiroshi YAMAMOTO

IPC分类号： H05K1/02 ,  H05K3/10 ,  H01S5/022 ,  H05K1/18 ,  H05K1/14

CPC分类号： H05K1/025 ,  H01S5/02212 ,  H01S5/02276 ,  H01S5/06226 ,  H05K1/0274 ,  H05K1/141 ,  H05K1/189 ,  H05K3/103 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/10121 ,  H05K2203/049

摘要： An optical subassembly includes: a conductor plate having a pair of penetration holes, both penetrating the conductor plate from an outer surface to an inner surface; a pair of lead terminals fixed in the two respective penetration holes and passing through the pair of penetration holes; a wiring board with a pair of wiring patterns arranged on a surface; and a plurality of bonding wires electrically connecting the pair of lead terminals and the pair of wiring patterns. A cross section of the pair of lead terminals on the inner surface side is larger than a cross section on the outer surface side. End faces on the inner surface side are situated within a range from +180 μm to −100 μm to the inner side from the inner surface of the conductor plate in a direction perpendicular to the inner surface.

公开(公告)号：US20180228024A1

公开(公告)日：2018-08-09

申请号：US15942159

申请日：2018-03-30

申请人： Apple Inc.

发明人： Daniel D. Sunshine ,  Daniel A. Podhajny ,  Kathryn P. Crews ,  Kirk M. Mayer ,  John Arthur Maasberg

IPC分类号： H05K1/03 ,  C23C18/16 ,  H01B13/00

CPC分类号： H05K1/038 ,  C23C18/16 ,  C23C18/1633 ,  C25D7/0607 ,  H01B13/0026 ,  H01B13/0036 ,  H05K3/103 ,  H05K2201/0281

摘要： Strands of material may be intertwined using weaving techniques, knitting techniques, non-woven or entanglement techniques, or braiding techniques. Fabric that is formed from the strands of material may be used in forming a fabric-based item. The fabric based item may include electrical components. The strands may include conductive strands that form signal paths. The signal paths can carry electrical signals associated with operation of the electrical components. Each strand may have an elongated core and a coating. Strands may also include intermediate layers between the cores and coatings. The cores, intermediate layers, and coatings may be formed from polymer without conductive filler, polymer with conductive filler, and/or metal. A polymer core may be provided with recesses to help retain subsequently deposited layers such as a metal coating layer. The recesses may be grooves that extend along the longitudinal axis of the core.

公开(公告)号：US09927833B2

公开(公告)日：2018-03-27

申请号：US14907117

申请日：2013-07-22

申请人： Hewlett-Packard Development Company, L.P.

发明人： John Norton

IPC分类号： G06F1/16 ,  H05K1/18 ,  H05K3/30 ,  H05K3/10 ,  H05K3/40

CPC分类号： G06F1/16 ,  H05K1/18 ,  H05K3/103 ,  H05K3/30 ,  H05K3/4046 ,  H05K2201/09063 ,  H05K2201/10287 ,  H05K2201/10719 ,  H05K2201/10962

摘要： A printed circuit board (PCB) can include a central processing unit (CPU) installed on a first surface of the PCB. The PCB can also include a cable routed on a second surface of the PCB parallel to the first surface. The PCB can further include a hole extending through a thickness of the PCB to connect the first surface and the second surface. The cable can extend through the hole to be coupled to the CPU.

公开(公告)号：US20170347455A1

公开(公告)日：2017-11-30

申请号：US15601225

申请日：2017-05-22

申请人： SHINKO ELECTRIC INDUSTRIES CO., LTD.

发明人： Shoji Watanabe

IPC分类号： H05K1/18 ,  H05K3/28 ,  H05K1/11 ,  H05K3/10 ,  H05K3/40 ,  H05K3/32

CPC分类号： H05K1/18 ,  H05K1/113 ,  H05K3/103 ,  H05K3/287 ,  H05K3/32 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/10674 ,  H05K2201/10977

摘要： A circuit board includes an insulating layer having a protrusion on a surface, and a connection pad formed on an upper surface of the protrusion. A peripheral portion of a lower surface of the connection pad is exposed from the protrusion.

公开(公告)号：US09832881B2

公开(公告)日：2017-11-28

申请号：US14785281

申请日：2014-04-18

申请人： INKTEC CO., LTD.

发明人： Kwang-Choon Chung ,  Ji Hoon Yoo ,  Joonki Seong ,  Dae sang Han

IPC分类号： H05K1/03 ,  H05K3/10 ,  H01B1/22 ,  C09D11/52 ,  H05K1/02 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12

CPC分类号： H05K3/103 ,  C09D11/52 ,  H01B1/22 ,  H05K1/0274 ,  H05K1/0296 ,  H05K1/032 ,  H05K1/09 ,  H05K3/002 ,  H05K3/0055 ,  H05K3/007 ,  H05K3/12 ,  H05K2203/06

摘要： Provided herein is a method for forming a transparent electrode film for display and the transparent electrode film for display, the method comprising forming an electrode pattern by printing a fine electrode pattern on a release film using a conductive ink composition; forming an insulating layer by applying an insulating resin on the release film on which the electrode pattern has been formed; forming a substrate layer by laminating a substrate on the insulating layer; and removing the release film.

公开(公告)号：US09795035B2

公开(公告)日：2017-10-17

申请号：US15356852

申请日：2016-11-21

申请人： HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC

发明人： Jonathan Douglas Hatch ,  Stephen McGarry Hatch

IPC分类号： H05K1/14 ,  H05K3/46 ,  H05K1/02 ,  H05K3/10 ,  H05K3/38 ,  H05K3/12 ,  H05K1/11

CPC分类号： H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

摘要： A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

公开(公告)号：US09782111B2

公开(公告)日：2017-10-10

申请号：US14314596

申请日：2014-06-25

申请人： GlySens, Inc., a California Corporation

发明人： Joseph Y. Lucisano ,  Richard E. Calou ,  Mark B. Catlin ,  Joe T. Lin ,  Timothy L. Routh

IPC分类号： A61B5/1473 ,  H01L23/10 ,  H01L23/15 ,  A61B5/145 ,  H05K3/00 ,  H05K3/10 ,  H01R43/00 ,  H01L23/498 ,  H01L21/48

CPC分类号： A61B5/1473 ,  A61B5/14532 ,  H01L21/486 ,  H01L23/10 ,  H01L23/15 ,  H01L23/49827 ,  H01L2924/0002 ,  H01R43/00 ,  H05K3/0047 ,  H05K3/0055 ,  H05K3/103 ,  Y10T29/49147 ,  Y10T29/49162 ,  Y10T29/49176 ,  Y10T29/49222 ,  H01L2924/00

摘要： A wire extends through a ceramic body. The wire comprises a material selected from the group consisting of platinum, palladium, rhodium, iridium, osmium and alloys of platinum, palladium, rhodium, iridium, and osmium. The wire directly contacts the ceramic body to form a substantially hermetic seal between the ceramic body and the wire.

公开(公告)号：US09781839B1

公开(公告)日：2017-10-03

申请号：US14883302

申请日：2015-10-14

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： David Neuman ,  Robert Neuman ,  Pat Connolly ,  Brian Backes

IPC分类号： H05K3/10 ,  H05K3/32

CPC分类号： H05K3/321 ,  H05K3/10 ,  H05K3/103 ,  H05K2201/10287

摘要： A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.

公开(公告)号：US20170164463A1

公开(公告)日：2017-06-08

申请号：US15356852

申请日：2016-11-21

申请人： HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC

发明人： JONATHAN DOUGLAS HATCH ,  STEPHEN MCGARRY HATCH

IPC分类号： H05K1/02 ,  H05K3/46 ,  H05K3/12 ,  H05K1/11 ,  H05K3/10 ,  H05K3/38

CPC分类号： H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

摘要： A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

公开(公告)号：US20170086304A1

公开(公告)日：2017-03-23

申请号：US14859026

申请日：2015-09-18

申请人： Delaware Capital Formation, Inc.

发明人： Mark Hahn

IPC分类号： H05K3/10 ,  B23K26/0622 ,  B23K9/09 ,  B23K26/21 ,  H05K1/18 ,  B23K9/167

CPC分类号： H05K3/103 ,  B23K9/0043 ,  B23K9/091 ,  B23K9/092 ,  B23K9/167 ,  B23K9/23 ,  B23K26/0622 ,  B23K26/21 ,  B23K26/22 ,  B23K26/32 ,  B23K2101/38 ,  B23K2103/00 ,  H01L23/49811 ,  H01L24/02 ,  H01L24/05 ,  H01L24/07 ,  H01L24/08 ,  H01L24/09 ,  H01L24/42 ,  H01L24/44 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02163 ,  H01L2224/02185 ,  H01L2224/04042 ,  H01L2224/45147 ,  H01L2224/45639 ,  H01L2224/48476 ,  H01L2224/80007 ,  H01L2224/80009 ,  H01L2224/8019 ,  H01L2224/8034 ,  H01L2924/00014 ,  H05K1/18 ,  H05K3/328 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.