公开(公告)号：US10120423B1

公开(公告)日：2018-11-06

申请号：US14849350

申请日：2015-09-09

Applicant: Amazon Technologies, Inc.

Inventor： Bradley David Urban ,  Troy Hulick ,  Shelomon Patrick Doblack ,  Robert Olson ,  Albert John Yu Sam Chua ,  Daniel Jones ,  Adam Kenneth Cybart ,  Gaurav Soni ,  William James Carter-Giannini ,  Matthew Michael Seflic

IPC: H05K7/20 ,  G06F1/20 ,  B29C65/00 ,  B29L9/00

Abstract: Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.