公开(公告)号：US10041894B1

公开(公告)日：2018-08-07

申请号：US14849471

申请日：2015-09-09

Applicant: Amazon Technologies, Inc.

Inventor： Mohammed Aftab Alam ,  Bradley David Urban ,  Gaurav Soni ,  Ramez Nachman

IPC: G01N25/18

Abstract: Determining an in-plane thermal conductivity of anisotropic materials, such as display stacks, printed circuit boards (PCBs), and composite housings, includes heating a first region of an anisotropic sample, cooling a second region of the sample, and measuring temperature at a first location between the first region and the second region and a second location between the first region and the second region. The in-plane thermal conductivity of the sample is computed based at least in part on the temperature at the first location, the temperature at the second location, the distance from the first region to the second region, a thickness of the substantially planar anisotropic substrate, and an amount of heat applied to the first region.

公开(公告)号：US10120423B1

公开(公告)日：2018-11-06

申请号：US14849350

申请日：2015-09-09

Applicant: Amazon Technologies, Inc.

Inventor： Bradley David Urban ,  Troy Hulick ,  Shelomon Patrick Doblack ,  Robert Olson ,  Albert John Yu Sam Chua ,  Daniel Jones ,  Adam Kenneth Cybart ,  Gaurav Soni ,  William James Carter-Giannini ,  Matthew Michael Seflic

IPC: H05K7/20 ,  G06F1/20 ,  B29C65/00 ,  B29L9/00

Abstract: Described herein are unibody thermal enclosures for electronic devices. In some instances, the enclosure is a unibody structure formed by injecting a structural material into the tool suspending thermal absorbing/spreading material and thermal insulating material within a cavity of the tool. In other instances, the thermal absorbing/spreading material may be exposed to circuitry of the electronic device and the thermal insulating material may be exposed to the exterior of the electronic device.