公开(公告)号：US11656605B1

公开(公告)日：2023-05-23

申请号：US17105389

申请日：2020-11-25

Applicant: Amazon Technologies, Inc.

Inventor： David Manley ,  Marinus Jan de Putter

IPC: G05B19/10 ,  G05B19/418 ,  G06K9/62 ,  G06N5/04 ,  G06N3/08 ,  G05B23/02

CPC classification number: G05B19/4183 ,  G05B19/4184 ,  G05B23/02 ,  G06K9/6256 ,  G06N3/08 ,  G06N5/04 ,  G05B2219/32179 ,  G05B2219/32181 ,  G05B2219/32184 ,  G05B2219/32194 ,  G05B2219/32198

Abstract: An industrial monitoring system comprises a monitoring device attached to an industrial device by a bond. Sensor data collected by the monitoring device during a commissioning period is received and used to train a machine learning model. Subsequent to the commissioning period, additional sensor data is collected by the monitoring device. An abnormal state of the bond between the monitoring device and industrial device is determined based on the additional sensor data and a characteristic inferred by the trained machine learning model. A notification of the abnormal state is generated.