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公开(公告)号：US11656605B1
公开(公告)日：2023-05-23
申请号：US17105389
申请日：2020-11-25
CPC分类号： G05B19/4183 , G05B19/4184 , G05B23/02 , G06K9/6256 , G06N3/08 , G06N5/04 , G05B2219/32179 , G05B2219/32181 , G05B2219/32184 , G05B2219/32194 , G05B2219/32198
摘要： An industrial monitoring system comprises a monitoring device attached to an industrial device by a bond. Sensor data collected by the monitoring device during a commissioning period is received and used to train a machine learning model. Subsequent to the commissioning period, additional sensor data is collected by the monitoring device. An abnormal state of the bond between the monitoring device and industrial device is determined based on the additional sensor data and a characteristic inferred by the trained machine learning model. A notification of the abnormal state is generated.
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公开(公告)号：US11477547B1
公开(公告)日：2022-10-18
申请号：US17105374
申请日：2020-11-25
摘要： An industrial monitoring system comprises monitoring devices that are enabled for debugging by a component comprising a first microcontroller unit and a second microcontroller unit. The monitoring device receives a debugging command based on a subscription, on a publish-subscribe communications channel, to events indicative of requests to perform debugging operation. The second microcontroller unit causes the first microcontroller unit to perform the command. Results of performing the command are returned by publishing an event to the publish-subscribe communications channel.
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公开(公告)号：USD941693S1
公开(公告)日：2022-01-25
申请号：US29716682
申请日：2019-12-11
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