公开(公告)号：US09791506B1

公开(公告)日：2017-10-17

申请号：US14925044

申请日：2015-10-28

Applicant: Amazon Technologies, Inc.

Inventor： Yaniv Meidan ,  Ronen Shitrit ,  Guy Zalik ,  Barak Wasserstrom

IPC: G01R31/28 ,  G01R31/3177 ,  G01R31/317

CPC classification number: G01R31/31907 ,  G01R31/31919

Abstract: In one example case, a cross-platform system includes a first automated test platform having a first test instrument and a first glue layer interface that exposes test functions to direct testing by the first test instrument. The system further includes a second automated test platform having a second test instrument and a second glue layer interface that exposes the same test functions to direct testing by the second test instrument. In the system, the glue layers abstract the respective and different control commands used by the different, first and second test instruments. Using the glue layers, the same higher-level test code can be executed by the control computers of both the first and second automated test platforms.