公开(公告)号：US11527451B2

公开(公告)日：2022-12-13

申请号：US17339300

申请日：2021-06-04

申请人： Ampleon Netherlands B.V.

发明人： Leonardus Theodorus Maria Raben ,  Franciscus Gerardus Maria Meeuwsen ,  Jan Joseph Briones Miranda

IPC分类号： H01L23/057 ,  H01L23/08 ,  H01L23/00

摘要： The present invention relates to a molded air-cavity package. In addition, the present invention is related to a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency ‘RF’ applications including but not limited to RF power amplifiers.
Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.

公开(公告)号：US11823986B2

公开(公告)日：2023-11-21

申请号：US17478049

申请日：2021-09-17

申请人： Ampleon Netherlands B.V.

发明人： Leonardus Theodorus Maria Raben

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L23/49555 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/49861 ,  H01L23/3121 ,  H01L23/49568 ,  H01L24/48 ,  H01L2224/48245

摘要： The present disclosure relates to a molded radiofrequency, ‘RF’, power package. The present disclosure further relates to a method for manufacturing such package.
According to example embodiments, weakening structures are provided in the leads to allow the leads to be bent without causing delamination in the body of solidified molding compound.

公开(公告)号：US20210384092A1

公开(公告)日：2021-12-09

申请号：US17339300

申请日：2021-06-04

申请人： Ampleon Netherlands B.V.

发明人： Leonardus Theodorus Maria Raben ,  Franciscus Gerardus Maria Meeuwsen ,  Jan Joseph Briones Miranda

IPC分类号： H01L23/057 ,  H01L23/08 ,  H01L23/00

摘要： The present invention relates to a molded air-cavity package. In addition, the present invention is related to a device comprising the same. The present invention is particularly related to molded air-cavity packages for radio-frequency ‘RF’ applications including but not limited to RF power amplifiers.
Instead of using hard-stop features that are arranged around the entire perimeter of the package in a continuous manner, the present invention proposes to use spaced apart pillars formed by first and second cover supporting elements. By using only a limited amount of pillars, e.g. three or four, the position of the cover relative to the body can be defined in a more predictable manner. This particularly holds if the pillars are arranged in the outer corners of the package.