公开(公告)号：US10522389B2

公开(公告)日：2019-12-31

申请号：US14923828

申请日：2015-10-27

Applicant: Analog Devices, Inc.

Inventor： James Fiorenza ,  F. Jacob Steigerwald ,  Edward F. Gleason ,  Susan L. Feindt

IPC: G03F7/00 ,  H01L21/762 ,  H01L25/065 ,  H01L25/00 ,  H01L21/67 ,  H01L23/525

Abstract: A transfer printing method provides a first wafer having a receiving surface, and removes a second die from a second wafer using a die moving member. Next, the method positions the second die on the receiving surface of the first wafer. Specifically, to position the second die on the receiving surface, the first wafer has alignment structure for at least in part controlling movement of the die moving member.