公开(公告)号：US20250141416A1

公开(公告)日：2025-05-01

申请号：US18498702

申请日：2023-10-31

Applicant: Analog Devices, Inc.

Inventor： Gregory J. Manlove ,  Eric A. Sagen

IPC: H03F3/45 ,  H03F1/32 ,  H03G3/00 ,  H03M1/74

Abstract: This disclosure describes various bidirectional current sensing techniques. The solution described utilizes a matched thermal substrate, e.g., copper, in conjunction with the front two amplifiers of a three amplifier instrumentation amplifier. The bidirectional system current sensor module described utilizes the matched thermal substrate approach to cancel out temperature coefficient dependency in the sensor. Behind the lead two amplifiers, the circuits can be varied to support factory gain trim and voltage or current mode type outputs.

公开(公告)号：US20250138060A1

公开(公告)日：2025-05-01

申请号：US18498731

申请日：2023-10-31

Applicant: Analog Devices, Inc.

Inventor： Eric A. Sagen ,  Gregory J. Manlove

IPC: G01R19/25

Abstract: Described are techniques to provide a gain trim term in the numerator for a current sensor control loop. In this manner, a linear gain trim relationship is created with respect to the trim code. This linear relationship reduces the dynamic range needed for the DAC, which allows the use of lower resolution DACs to smoothly adjust the gain while maintaining stability and accuracy.

公开(公告)号：US20210382091A1

公开(公告)日：2021-12-09

申请号：US17283860

申请日：2019-10-30

Applicant: ANALOG DEVICES, INC.

Inventor： Michael D. Petersen ,  Kalin V. Lazarov ,  Gregory J. Manlove ,  Robert Chiacchia

IPC: G01R15/14 ,  G01R19/32

Abstract: A system current sensor module can accurately sense or measure system current flowing through a sense current resistor by shunting current through a gain-setting resistor and using an amplifier to measure a resulting voltage, with an output transistor controlled by the amplifier controlling current through the gain setting resistor in a manner that tends to keep the amplifier inputs at the same voltage. The resistors can be thermally coupled to maintain similar temperatures when a system current is flowing. The thermal coupling can include conducting heat from a first resistor layer carrying the current sense resistor to a thermal cage layer located beyond a second resistor layer carrying the gain-setting resistor. This preserves accuracy, including during aging.

公开(公告)号：US20240169131A1

公开(公告)日：2024-05-23

申请号：US18057923

申请日：2022-11-22

Applicant: Analog Devices, Inc.

Inventor： Armando Presti ,  Gregory J. Manlove ,  Douglas Huhmann

IPC: G06F30/32 ,  G01R19/00

CPC classification number: G06F30/32 ,  G01R19/00

Abstract: Apparatus and methods for programming multiple parameters per pin of an IC are disclosed herein. In certain embodiments, system operation parameters of an IC are set using external component(s) in conjunction with an internal detection circuit of the IC. The internal detection circuit allows for programming of multiple parameters with one pin of the IC, thereby reducing package size, board area, and/or chip complexity. For example, the teachings herein allow for detection of three or more unique parameters or states per pin, significantly reducing the part pin count and board area.