公开(公告)号：US12002838B2

公开(公告)日：2024-06-04

申请号：US16705105

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Mark Downey ,  Santosh Anil Kudtarkar

IPC: H01L27/146 ,  G01T1/24 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L27/14661 ,  G01T1/244 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14659 ,  H01L2224/29083 ,  H01L2224/32227 ,  H01L2924/3025

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

公开(公告)号：US20200185450A1

公开(公告)日：2020-06-11

申请号：US16705105

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Mark Downey ,  Santosh Anil Kudtarkar

IPC: H01L27/146 ,  G01T1/24

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.