公开(公告)号：US20240213188A1

公开(公告)日：2024-06-27

申请号：US18542393

申请日：2023-12-15

Applicant: ANALOG DEVICES, INC.

Inventor： Santosh Anil Kudtarkar ,  Arun Raj ,  Sharad Vidyarthy ,  Thomas M. Goida

IPC: H01L23/66 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498

CPC classification number: H01L23/66 ,  H01L23/3675 ,  H01L23/49816 ,  H01L24/08 ,  H01L24/16 ,  H01L2223/6616 ,  H01L2224/08146 ,  H01L2224/08235 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/182

Abstract: An integrated device package may include a glass interposer having one or more conductive vias extending through the glass interposer from a top side of the glass interposer to a bottom side of the glass interposer, the bottom side of the glass interposer comprising one or more contact pads. The device package may include an integrated device die mounted and electrically connected to the top side of the glass interposer. The device package may also include an encapsulating material disposed over at least a side surface of the glass interposer, a portion of the top surface of the glass interposer, and a side surface of the integrated device die.

公开(公告)号：US11688709B2

公开(公告)日：2023-06-27

申请号：US16705123

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Santosh Anil Kudtarkar

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L27/146 ,  H01L23/552

CPC classification number: H01L24/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/05 ,  H01L24/48 ,  H01L27/14632 ,  H01L27/14661 ,  H01L2224/04042 ,  H01L2224/24265 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/19041 ,  H01L2924/19102 ,  H01L2924/3025

Abstract: An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.

公开(公告)号：US12002838B2

公开(公告)日：2024-06-04

申请号：US16705105

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Mark Downey ,  Santosh Anil Kudtarkar

IPC: H01L27/146 ,  G01T1/24 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L27/14661 ,  G01T1/244 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14659 ,  H01L2224/29083 ,  H01L2224/32227 ,  H01L2924/3025

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

公开(公告)号：US20200185450A1

公开(公告)日：2020-06-11

申请号：US16705105

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Mark Downey ,  Santosh Anil Kudtarkar

IPC: H01L27/146 ,  G01T1/24

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

公开(公告)号：US20200185346A1

公开(公告)日：2020-06-11

申请号：US16705123

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Santosh Anil Kudtarkar

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L27/146 ,  H01L23/552

Abstract: An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.