公开(公告)号：US20190232021A1

公开(公告)日：2019-08-01

申请号：US16261333

申请日：2019-01-29

Applicant: ANALOG DEVICES, INC.

Inventor： Vikram Venkatadri ,  David Frank Bolognia

IPC: A61M25/01

CPC classification number: A61M25/0127 ,  A61B5/062 ,  A61B2562/164 ,  A61M2025/0166

Abstract: An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.

公开(公告)号：US11764392B2

公开(公告)日：2023-09-19

申请号：US15909849

申请日：2018-03-01

Applicant: ANALOG DEVICES, INC.

Inventor： Kelvin Po Leung Pun ,  Vikram Venkatadri ,  David Frank Bolognia ,  Chee Wah Cheung

IPC: H01M10/0585 ,  H01M10/04 ,  H01M4/66 ,  H01M4/04 ,  H01M50/55 ,  H05K3/32

CPC classification number: H01M10/0436 ,  H01M4/0407 ,  H01M4/0414 ,  H01M4/667 ,  H01M10/0585 ,  H01M50/55 ,  H05K3/321

Abstract: A battery assembly is disclosed. The battery assembly can include a first electrode disposed in a first substrate section and a second electrode disposed in a second substrate section. The battery assembly can also include an adhesive that bonds the first substrate section to the second substrate section. The adhesive partially defines a chamber between the first and second electrodes. The battery assembly can also include an electrolyte disposed in the chamber between the first and second electrodes.

公开(公告)号：US11503145B2

公开(公告)日：2022-11-15

申请号：US16305019

申请日：2017-05-25

Applicant: Analog Devices, Inc.

Inventor： J. Brian Harrington ,  David F. Bolognia ,  Alain Valentin Guery ,  Vikram Venkatadri ,  Hari Chauhan ,  Evgueni Ivanov ,  Carlos R. Calvo

IPC: H04M1/21 ,  H04B10/40 ,  H04M1/72403 ,  H04M1/72412

Abstract: According to one example configuration, an apparatus enhances functionality of a mobile communication device. The apparatus includes an encasement in which to retain the mobile communication device and supplemental circuitry. The supplemental circuitry is operable to: i) control an optical transmitter in the supplemental circuitry to irradiate matter under test, ii) monitor attributes of an optical signal reflected off the matter under test and received by the optical receiver; and iii) communicate the attributes of the optical signal from the supplemental circuitry to the mobile communication device over a communication link. The supplemental circuitry optionally includes multiple electrodes to further monitor attributes of the matter under test.

公开(公告)号：US11056455B2

公开(公告)日：2021-07-06

申请号：US16017986

申请日：2018-06-25

Applicant: ANALOG DEVICES, INC.

Inventor： Vikram Venkatadri ,  David Frank Bolognia

IPC: H01L23/00 ,  H01L21/56 ,  H01L27/146

Abstract: In some embodiments, an electronic module is disclosed. The electronic module can include a carrier and an integrated device die having an upper surface, a lower surface, and an outer side edge. The integrated device die can include a first surface recessed from the lower surface and a second surface extending between the lower surface and the first surface. The second surface can be laterally inset from the outer side edge. The electronic module can include a mounting compound comprising a first portion disposed between the lower surface of the integrated device die and the carrier and a second portion disposed along at least a portion of the second surface of the integrated device die.

公开(公告)号：US11688709B2

公开(公告)日：2023-06-27

申请号：US16705123

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Santosh Anil Kudtarkar

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L27/146 ,  H01L23/552

CPC classification number: H01L24/24 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/05 ,  H01L24/48 ,  H01L27/14632 ,  H01L27/14661 ,  H01L2224/04042 ,  H01L2224/24265 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2924/19041 ,  H01L2924/19102 ,  H01L2924/3025

Abstract: An integrated device package is disclosed. The package can include a package substrate and an integrated device die having active electronic circuitry. The integrated device die can have a first side and a second side opposite the first side. The first side can have bond pads electrically connected to the package substrate by way of bonding wires. A redistribution layer (RDL) stack can be disposed on a the first side of the integrated device die. The RDL stack can comprise an insulating layer and a conductive redistribution layer. The package can include a passive electronic device assembly mounted and electrically connected to the RDL stack.

公开(公告)号：US11664340B2

公开(公告)日：2023-05-30

申请号：US16927853

申请日：2020-07-13

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  David Frank Bolognia

IPC: H01L23/31 ,  H01L23/00

CPC classification number: H01L24/32 ,  H01L23/3157 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125

Abstract: An electronic module is disclosed. The electronic module can include a package substrate, an integrated device die, a dam structure, and a mounting compound. The integrated device die can have an upper side, a lower side, and an outer side edge. The dam structure can have a first sidewall and a second sidewall opposite the first sidewall. The second sidewall can be nearer to the outer side edge than the first sidewall. The first sidewall can be laterally positioned between a center of the lower side of the integrated device die and the outer side edge. The dam structure can be disposed between a portion of the package substrate and a portion of the lower side of the integrated device die. The mounting compound can be disposed between the lower side of the integrated device die and the package substrate. The dam structure can be positioned between the mounting compound and the outer side edge of the integrated device die.

公开(公告)号：US10074624B2

公开(公告)日：2018-09-11

申请号：US14821228

申请日：2015-08-07

Applicant: ANALOG DEVICES, INC.

Inventor： Vikram Venkatadri

IPC: H01L23/00

CPC classification number: H01L24/06 ,  H01L23/293 ,  H01L23/3192 ,  H01L24/03 ,  H01L24/05 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/0603 ,  H01L2224/06153 ,  H01L2224/06155 ,  H01L2224/0616 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2924/351 ,  H01L2224/05599 ,  H01L2924/014

Abstract: Integrated circuit dies are provide with a passivation layer having a plurality of differently sized openings exposing bond pads for bonding. The sizes of the bond pads vary in a manner that at least partially compensates for stresses during bonding, such as flip chip thermocompression bonding, due to asymmetric distribution of bond pads.

公开(公告)号：US12002838B2

公开(公告)日：2024-06-04

申请号：US16705105

申请日：2019-12-05

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  Mark Downey ,  Santosh Anil Kudtarkar

IPC: H01L27/146 ,  G01T1/24 ,  H01L23/00 ,  H01L23/552

CPC classification number: H01L27/14661 ,  G01T1/244 ,  H01L23/552 ,  H01L24/29 ,  H01L24/32 ,  H01L27/14618 ,  H01L27/14623 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14659 ,  H01L2224/29083 ,  H01L2224/32227 ,  H01L2924/3025

Abstract: An integrated device package is disclosed. The integrated device package can include a package substrate having a plurality of contact pads on a first side of the package substrate, the plurality of contact pads configured to electrically connect to a sensor assembly. The package can include a radiation shield attached to a second side of the package substrate by way of a first adhesive, the first side opposite the second side. The package can include an integrated device die attached to the radiation shield by way of a second adhesive. The integrated device die can comprise sensitive active electronic circuitry in a sensitive active region of the integrated device die. A molding compound can be disposed over the integrated device die and the radiation shield.

公开(公告)号：US20220062535A1

公开(公告)日：2022-03-03

申请号：US17005222

申请日：2020-08-27

Applicant: Analog Devices, Inc.

Inventor： David Frank Bolognia ,  J Brian Harrington ,  Vikram Venkatadri

IPC: A61M5/142 ,  F04B17/00 ,  F04B13/00

Abstract: A flow control system is disclosed. The flow control system can include a flow meter positioned at a first location of a flow path of a fluid substance, and a valve positioned at a second location of the flow path of the fluid substance. The flow meter can include a molded non-conductive housing, a heating element that is at least partially embedded in the housing, and a sensing element that is at least partially embedded in the housing. The valve can open the flow path to allow the fluid substance to flow in the flow path. The valve can include an actuator that includes deformable chamber and a gate in the flow path of the fluid substance.

公开(公告)号：US20220013490A1

公开(公告)日：2022-01-13

申请号：US16927853

申请日：2020-07-13

Applicant: Analog Devices, Inc.

Inventor： Vikram Venkatadri ,  David Frank Bolognia

IPC: H01L23/00 ,  H01L23/31

Abstract: An electronic module is disclosed. The electronic module can include a package substrate, an integrated device die, a dam structure, and a mounting compound. The integrated device die can have an upper side, a lower side, and an outer side edge. The dam structure can have a first sidewall and a second sidewall opposite the first sidewall. The second sidewall can be nearer to the outer side edge than the first sidewall. The first sidewall can be laterally positioned between a center of the lower side of the integrated device die and the outer side edge. The dam structure can be disposed between a portion of the package substrate and a portion of the lower side of the integrated device die. The mounting compound can be disposed between the lower side of the integrated device die and the package substrate. The dam structure can be positioned between the mounting compound and the outer side edge of the integrated device die